Intel E2180 Support Question

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Question posted by tuffytedy on May 1st, 2010

E2180 Overclocking Guide

E2180 + MS-7507-050 MSI Intel 945GCM7-Loverclocking

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Related Intel E2180 Manual Pages

Design Guide - Page 1

Intel® Pentium® Dual Core Processor E2000 Δ Series - Intel® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Core™2 Duo Processor E6000 Δ and E4000 Δ Series - Intel® Celeron® Dual-Core Processor E1000&#...

Design Guide - Page 2

... by estoppel or otherwise, to deviate from product infringement or product warranty. The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may contain design defects or errors known as the property of the information provided. Intel may have no liability for the design, sale and functionality of performance...

Design Guide - Page 6

...Passive Heatsink ...31 Figure 4-1. Minimum Required Processor Preload to the LGA775 Socket 94 Figure 7-16. Intel® QST Overview 70 Figure 7-2. ...Core Dimension 67 Figure 7-1. Omega Thermocouple 90 Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit .....92 Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit on the 775...

Design Guide - Page 9

...• Added Intel® Pentium® Dual Core processor E2180 specifications • Added Intel® Pentium® Dual Core processor E2160 and E2140 at Tcmax of 73.3 °C • Added Intel® Core™2 Duo Desktop processor E4600 • Added Intel® Pentium® Dual Core processor E2200 specifications • Added Intel® Celeron® Dual-Core processor E1000Δ...

Design Guide - Page 11

... used will be required to provide adequate cooling for meeting the thermal requirements imposed on single processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000Δ series. The result is an increased importance on system design to ensure that...

Design Guide - Page 12

... at Tc-max of 73.3 °C applies to Intel® Core™2 Duo processors E6400, E4600, E4500, E4400, and E4300 • Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C applies to the Intel® Pentium® Dual Core processors E2220, E2200, E2180, E2160, and E2140 • Intel® Celeron® dual-core processor E1000 Series of Tc-max of 73.3 °...

Design Guide - Page 13

...temperature locally surrounding the processor. Document Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance...

Design Guide - Page 15

... datasheet supersedes dimensions provided in the LGA775 Socket Mechanical Design Guide. In case of IHS to install a heatsink IHS Step to the processor datasheet for further information. The socket contains 775 contacts arrayed about a cavity in the center of the socket is in this document. Figure 2-1. The processor connects to the datasheet for detailed mechanical specifications...

Design Guide - Page 16

... used as described in the processor datasheet • The heatsink mass can also generate additional dynamic compressive load to the package during an 11 ms trapezoidal shock with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during a mechanical shock event. Amplification factors due to the LGA775 Socket Mechanical Design Guide for contacting a heatsink. The...

Design Guide - Page 17

... met throughout the life of the product. stiffness for ATX (refer to support the processor should provide a means for the heatsink developed to Figure 7-47). • TMA ...by the LGA775 socket load plate (refer to the LGA775 Socket Mechanical Design Guide for further information). 2.1.2.2 Heatsink Clip Load Requirement The attach mechanism for protecting LGA775 socket solder joints. This...

Design Guide - Page 18

.... For illustration, Figure 2-2 shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-Land LGA processor package with a 28.7 mm x 28.7 mm [1.13 in x 1.13 in the LGA775 Socket Mechanical Design Guide with its tolerances. ⎯ The height of the package, from the package seating plane to the top of...

Design Guide - Page 22

... of the heatsink must take into consideration the package and socket load limits, the heatsink attach mechanical capabilities, and the mechanical shock and vibration profile targets. Processor Thermal/Mechanical Information 2.3.1 2.3.2 22 Passive heatsink solutions require in-depth knowledge of this design guide. • The motherboard primary side height constraints defined in the...

Design Guide - Page 23

... the Balanced Technology Extended (BTX) System Design Guide. Note: The 550g mass limit for BTX heatsinks... capabilities of greater than 550g should not exceed 550g. Intel recommends testing and validating heatsink performance in a way that...The package IHS flatness for heatsink-to combined socket and heatsink loading. Processor Thermal/Mechanical Information The recommended maximum heatsink ...

Design Guide - Page 24

The following tables show the TA requirements for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- The number, size and relative position of Intel Reference Thermal Solutions ATX D60188001 ATX E18764-001 BTX Type II Heatsink Inlet Temperature 40 °C 40 °C 35.5 &#...

Design Guide - Page 42

... °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core Processor E1000 series...

Design Guide - Page 50

...of units that there is no risk of personal injury. 5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7-50 through Figure 7-54 in Appendix H gives the... information for the Intel Type II TMA Reference Solution is provided in the BTX Interface Specification for Zone A, found in Balanced Technology Extended (BTX) System Design Guide available at http://www...

Design Guide - Page 52

... Thermal Module is the Thermal Module assembly effective stiffness. Minimum Required Processor Preload to Thermal Module Assembly Stiffness NOTES: 1. The nominal preload design... the BTX Interface Specification and Support Retention Mechanism (SRM) Design Guide. Processor Preload Limits Parameter Minimum Required Maximum Allowed Notes Processor Preload 98 N [22 lbf] 222 N [50 lbf] ...

Design Guide - Page 55

... Design Requirements This chapter will document the requirements for an active air-cooled design, with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at the top of the heatsink. The D60188-001 reference design takes advantage of an acoustic improvement to reduce the fan speed...

Design Guide - Page 56

...-001Reference Design - Exploded View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at Tc-max...

Design Guide - Page 58

... 1, 2 1 1 NOTES: 1. E18764-001 Reference Heatsink Performance Processor Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core processor E1000 series at Tc-max of...