Mechanical Design Guidelines
Page 21
... design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the fastener. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of the... thermal interface material dispense or attach process in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is 550g. While socket loading alone may require the evaluation of IHS flatness change due to ...
... design structural ingredients is 900 grams. The BTX structural reference component strategy and design is reviewed in depth in the latest version of the fastener. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of the... thermal interface material dispense or attach process in the enabled state. 2.3.4 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is 550g. While socket loading alone may require the evaluation of IHS flatness change due to ...