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R A.2.2 Motherboard Deflection Metric Definition 62 A.2.3 Board Deflection Limits 63 A.2.4 Board Deflection Metric Implementation Example 64 A.2.5 Additional Considerations 65 A.2.5.1 Motherboard Stiffening Considerations 65 A.3 Heatsink Selection Guidelines 66 Appendix B Appendix C Heatsink Clip Load Metrology 67 B.1 Overview...67 B.2... Fan Speed Control Requirements 87 Appendix F Balanced Technology Extended (BTX) System Thermal Considerations 91 Appendix G Mechanical Drawings...93 Appendix H Intel Enabled Reference Solution Information 105 Thermal/Mechanical Design Guide 5
R A.2.2 Motherboard Deflection Metric Definition 62 A.2.3 Board Deflection Limits 63 A.2.4 Board Deflection Metric Implementation Example 64 A.2.5 Additional Considerations 65 A.2.5.1 Motherboard Stiffening Considerations 65 A.3 Heatsink Selection Guidelines 66 Appendix B Appendix C Heatsink Clip Load Metrology 67 B.1 Overview...67 B.2... Fan Speed Control Requirements 87 Appendix F Balanced Technology Extended (BTX) System Thermal Considerations 91 Appendix G Mechanical Drawings...93 Appendix H Intel Enabled Reference Solution Information 105 Thermal/Mechanical Design Guide 5
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...92 Figure 45. Sheet 2 95 Figure 47. Sheet 3 96 6 Thermal/Mechanical Design Guide Package IHS Load Areas 15 Figure 2. Intel® RCBFH-3 Reference Design (Exploded View 47 Figure 12. Thermistor Set Points 54 Figure 17. Fan Speed Control 56 Figure 19.... Monitor Control 33 Figure 8. Processor Thermal Characterization Parameter Relationships 26 Figure 5. Example: Defining Heatsink Preload Meeting Board Deflection Limit 64 Figure 24. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - ATX/µATX Motherboard...
...92 Figure 45. Sheet 2 95 Figure 47. Sheet 3 96 6 Thermal/Mechanical Design Guide Package IHS Load Areas 15 Figure 2. Intel® RCBFH-3 Reference Design (Exploded View 47 Figure 12. Thermistor Set Points 54 Figure 17. Fan Speed Control 56 Figure 19.... Monitor Control 33 Figure 8. Processor Thermal Characterization Parameter Relationships 26 Figure 5. Example: Defining Heatsink Preload Meeting Board Deflection Limit 64 Figure 24. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - ATX/µATX Motherboard...
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...integrated thermal management logic for thermal design. On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. Chapter 4 addresses the benefits of acoustic fan speed control. THE PHYSICAL ...DATA IN THE DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT. 10 Thermal/Mechanical Design Guide Chapter 5 provides information on the common Intel reference thermal solution for clarity, the specific processor will be listed. If needed for the Pentium 4 processor in the 775...
...integrated thermal management logic for thermal design. On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. Chapter 4 addresses the benefits of acoustic fan speed control. THE PHYSICAL ...DATA IN THE DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT. 10 Thermal/Mechanical Design Guide Chapter 5 provides information on the common Intel reference thermal solution for clarity, the specific processor will be listed. If needed for the Pentium 4 processor in the 775...
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...System Design Guide Document Link http://intel.com/design/pentium4/datashts/ 306382.htm http://developer.intel.com/design/Pentium 4/datashts/302351.htm http://developer.intel.com/design/Pentium 4/guides/302666.htm http://www.intel.com/go/integration http://www.formfactors...Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Intel® Pentium®...
...System Design Guide Document Link http://intel.com/design/pentium4/datashts/ 306382.htm http://developer.intel.com/design/Pentium 4/datashts/302351.htm http://developer.intel.com/design/Pentium 4/guides/302666.htm http://www.intel.com/go/integration http://www.formfactors...Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Intel® Pentium®...
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... do not generate substantial additional board deflection through life. Note that will occur in the motherboard. NOTES: 1. Example: Defining Heatsink Preload Meeting Board Deflection Limit 64 Thermal/Mechanical Design Guide However, there is for illustration purposes only, and relies on clip stiffness assumption. Figure 23. Check with d_EOL - No creep. The... similar to the correct end of the creep phenomenon. This situation is a result of life board deflection. It assumes no creep will lead to the Intel Reference Design.
... do not generate substantial additional board deflection through life. Note that will occur in the motherboard. NOTES: 1. Example: Defining Heatsink Preload Meeting Board Deflection Limit 64 Thermal/Mechanical Design Guide However, there is for illustration purposes only, and relies on clip stiffness assumption. Figure 23. Check with d_EOL - No creep. The... similar to the correct end of the creep phenomenon. This situation is a result of life board deflection. It assumes no creep will lead to the Intel Reference Design.