User Guide
Page 2
... provide any license, express or implied, by estoppel or otherwise, to the presented subject matter. Performance will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH...
... provide any license, express or implied, by estoppel or otherwise, to the presented subject matter. Performance will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH...
User Guide
Page 13
The enabled 4 wire fans use with the on -die thermal diode as a reference to change the duty cycle of the PWM signal. The heatsink, fan and duct ... TCONTROL_BASE TCONTROL_OFFSET TCONTROL PWM Health Monitor Component BTX TMA Fan Speed Control: Thermal solution that results in the value for TCONTROL Value read by the BIOS from the fan speed controller to the 4 pin fan header. Balanced Technology Extended: BTX is added to the TCONTROL_OFFSET that results in the value for...
The enabled 4 wire fans use with the on -die thermal diode as a reference to change the duty cycle of the PWM signal. The heatsink, fan and duct ... TCONTROL_BASE TCONTROL_OFFSET TCONTROL PWM Health Monitor Component BTX TMA Fan Speed Control: Thermal solution that results in the value for TCONTROL Value read by the BIOS from the fan speed controller to the 4 pin fan header. Balanced Technology Extended: BTX is added to the TCONTROL_OFFSET that results in the value for...
User Guide
Page 20
... thermal specification. This is achieved in such a way that regardless of TCONTROL. The value for TCONTROL is driven by the system BIOS based on -die thermal diode. The value of TCONTROL is calculated by a number of the processor cooling solution, while maintaining compliance... a part with lower value of these is offset by a higher value of TCONTROL in part by the on values read from the Intel enabled thermal solution. A thermal solution designed to program a fan speed control component. Acoustics (dBA) performance CA curves from a factory configured processor...
... thermal specification. This is achieved in such a way that regardless of TCONTROL. The value for TCONTROL is driven by the system BIOS based on -die thermal diode. The value of TCONTROL is calculated by a number of the processor cooling solution, while maintaining compliance... a part with lower value of these is offset by a higher value of TCONTROL in part by the on values read from the Intel enabled thermal solution. A thermal solution designed to program a fan speed control component. Acoustics (dBA) performance CA curves from a factory configured processor...
User Guide
Page 33
...to ensure proper processor operation. Enabling the Thermal Control Circuit allows the processor to attempt to Section 4.2.4 for details on this feature. Thermal/Mechanical Design Guide 33 During the boot process, the BIOS must be enabled to enable the Thermal Control Circuit while using... an "ondemand" mode. When the Thermal Control Circuit has been enabled, processor power consumption will always indicate the thermal status of the...
...to ensure proper processor operation. Enabling the Thermal Control Circuit allows the processor to attempt to Section 4.2.4 for details on this feature. Thermal/Mechanical Design Guide 33 During the boot process, the BIOS must be enabled to enable the Thermal Control Circuit while using... an "ondemand" mode. When the Thermal Control Circuit has been enabled, processor power consumption will always indicate the thermal status of the...
User Guide
Page 44
...have deformation or degradation in a temperature life test. Any plastic component exceeding 25 grams must be resistant to fungal growth. Intel® Thermal/Mechanical Reference Design Information R 5.2.2 5.2.3 5.3 Power Cycling Thermal performance degradation due to ensure proper operation of... the product before and after environmental stresses, with the thermal mechanical enabling components assembled. Recommended BIOS/Processor/Memory Test Procedures This test is to TIM degradation is evaluated using power cycling testing. Examples of ...
...have deformation or degradation in a temperature life test. Any plastic component exceeding 25 grams must be resistant to fungal growth. Intel® Thermal/Mechanical Reference Design Information R 5.2.2 5.2.3 5.3 Power Cycling Thermal performance degradation due to ensure proper operation of... the product before and after environmental stresses, with the thermal mechanical enabling components assembled. Recommended BIOS/Processor/Memory Test Procedures This test is to TIM degradation is evaluated using power cycling testing. Examples of ...