Product Specification
Page 7
... 4. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 19 7. Power States and Targeted System Power 33 9. Component-side Connectors 48 18. Manufacturing Options 11 3. Processor Heatsink for Omni-directional Airflow 61 25. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 18 5.
... 4. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 19 7. Power States and Targeted System Power 33 9. Component-side Connectors 48 18. Manufacturing Options 11 3. Processor Heatsink for Omni-directional Airflow 61 25. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 18 5.
Product Specification
Page 61
... website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of any thermal or system design remains solely with the reader. OM16996 Figure 24. Processor Heatsink for determining the adequacy... in Figure 24) to the following the instructions presented in this document will result in Section 2.14. 61 Use a processor heatsink that have been tested with Intel desktop boards please refer to maintain required airflow across the processor voltage regulator area.
... website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of any thermal or system design remains solely with the reader. OM16996 Figure 24. Processor Heatsink for determining the adequacy... in Figure 24) to the following the instructions presented in this document will result in Section 2.14. 61 Use a processor heatsink that have been tested with Intel desktop boards please refer to maintain required airflow across the processor voltage regulator area.
Product Specification
Page 63
... updates 103 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.3, page ...15 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is used to estimate repair rates and spare parts requirements. The MTBF prediction is calculated using component and subassembly random failure rates. The MTBF for the D945PAW...
... updates 103 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.3, page ...15 2.13 Reliability The Mean Time Between Failures (MTBF) prediction is used to estimate repair rates and spare parts requirements. The MTBF prediction is calculated using component and subassembly random failure rates. The MTBF for the D945PAW...