Data Sheet
Page 9
... Land Grid Array (FC-LGA8) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to the Intel® Pentium® dual-core processor E5200 and E5300. Terminology A '#' symbol after a signal name refers to an active low signal, indicating a signal is a high priority; "Front Side Bus" refers to as...
... Land Grid Array (FC-LGA8) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to the Intel® Pentium® dual-core processor E5200 and E5300. Terminology A '#' symbol after a signal name refers to an active low signal, indicating a signal is a high priority; "Front Side Bus" refers to as...
Data Sheet
Page 18
... Min Typ Max Unit Notes2, 10 VID Range VID 0.8500 - 1.3625 V 1 Core VCC Processor Number (2 MB Cache): E5200 E5300 VCC for 775_VR_CONFIG_06: 2.50 GHz 2.66 GHz Refer to Figure 1 for 775_VR_CONFIG_06: E5200 2.50 GHz E5300 2.66 GHz - - 5% - 1.10 1.50 - + 5% - 75 75 V V A6 FSB termination voltage on Intel 3 series Chipset family boards 1.045 1.1 1.155 VTT (DC + AC specifications) on...
... Min Typ Max Unit Notes2, 10 VID Range VID 0.8500 - 1.3625 V 1 Core VCC Processor Number (2 MB Cache): E5200 E5300 VCC for 775_VR_CONFIG_06: 2.50 GHz 2.66 GHz Refer to Figure 1 for 775_VR_CONFIG_06: E5200 2.50 GHz E5300 2.66 GHz - - 5% - 1.10 1.50 - + 5% - 75 75 V V A6 FSB termination voltage on Intel 3 series Chipset family boards 1.045 1.1 1.155 VTT (DC + AC specifications) on...
Data Sheet
Page 76
...are unlikely to cause the processor to consume maximum power dissipation for processor thermal solution design targets. Processor Thermal Specifications Processor Number Core Frequency (GHz) Thermal Design Power (W)3,4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 E5200 2.50 65.0 8 6 E5300 2.66 65.0 8 4... and not 100% tested. 2. Individual processors may have a lower TDP. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in the unlikely event that the processor can dissipate. 4. The Thermal Monitor feature...
...are unlikely to cause the processor to consume maximum power dissipation for processor thermal solution design targets. Processor Thermal Specifications Processor Number Core Frequency (GHz) Thermal Design Power (W)3,4 Extended HALT Power (W)1 Deeper Sleep Power (W)2 E5200 2.50 65.0 8 6 E5300 2.66 65.0 8 4... and not 100% tested. 2. Individual processors may have a lower TDP. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in the unlikely event that the processor can dissipate. 4. The Thermal Monitor feature...