HP BladeSystem c-Class architecture
Page 5
...and SAN (storage area network) solutions (www.hp.com/go /matrix). The BladeSystem c-Class interoperates and connects with management tools to the NonStop signal midplane. See "Technologies in the c3000 enclosure) to give better signal integrity, more DIMM slots per processor, and provide better... Uses vertical (rather than angled) DIMM connectors to support cost, reliability, and ease-of networking standards including Ethernet, Fibre Channel, FCoE, InfiniBand, iSCSI, and Serial Attached SCSI (SAS). BladeSystem interconnect modules support a variety of -use either full or half...
...and SAN (storage area network) solutions (www.hp.com/go /matrix). The BladeSystem c-Class interoperates and connects with management tools to the NonStop signal midplane. See "Technologies in the c3000 enclosure) to give better signal integrity, more DIMM slots per processor, and provide better... Uses vertical (rather than angled) DIMM connectors to support cost, reliability, and ease-of networking standards including Ethernet, Fibre Channel, FCoE, InfiniBand, iSCSI, and Serial Attached SCSI (SAS). BladeSystem interconnect modules support a variety of -use either full or half...
HP BladeSystem c-Class architecture
Page 13
... While there are extremely unlikely to provide power distribution with HP Thermal Logic With the BladeSystem architecture, HP consolidated power and cooling resources while efficiently sharing and managing them within an enclosure. HP estimates that the mean time between failure (MTBF) for decades...of solid copper plates and integrated power delivery pins to fail. Power backplane scalability and reliability The power backplane is in reduced cost, improved performance, and improved reliability. If this , we separated the power backplane from the NonStop signal midplane. By doing ...
... While there are extremely unlikely to provide power distribution with HP Thermal Logic With the BladeSystem architecture, HP consolidated power and cooling resources while efficiently sharing and managing them within an enclosure. HP estimates that the mean time between failure (MTBF) for decades...of solid copper plates and integrated power delivery pins to fail. Power backplane scalability and reliability The power backplane is in reduced cost, improved performance, and improved reliability. If this , we separated the power backplane from the NonStop signal midplane. By doing ...