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R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
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... its subsidiaries in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for more information including details on your own risk. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of the information provided...
... its subsidiaries in the 775-Land LGA Package may be claimed as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for more information including details on your own risk. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of the information provided...
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... for the On-Die Thermal Diode 36 THERMTRIP# Signal 37 4.2.8.1 Cooling System Failure Warning 37 Intel® Thermal/Mechanical Reference Design Information 39 5.1 Intel Validation Criteria for the Reference Design 39 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 Heatsink Performance Target 39 Acoustics...Material and Recycling Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach...
... for the On-Die Thermal Diode 36 THERMTRIP# Signal 37 4.2.8.1 Cooling System Failure Warning 37 Intel® Thermal/Mechanical Reference Design Information 39 5.1 Intel Validation Criteria for the Reference Design 39 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 Heatsink Performance Target 39 Acoustics...Material and Recycling Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach...
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... Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by... this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521 ...
... Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables • Updated the Fastener Drawings • Added Intel® Pentium® 4 processors 662 and 672 to the list of processors supported by... this thermal/mechanical design guide. • Added Intel® Pentium® 4 processors 571, 561, 551, 541, 531, and 521 ...
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... the processor as well as the physical constraints at and above the processor. The processor temperature depends in particular on single processor systems for the Intel® Pentium® 4 processor in the 775-Land LGA package. Document Goals Depending on system design to ensure that the temperatures of all components in a system...
... the processor as well as the physical constraints at and above the processor. The processor temperature depends in particular on single processor systems for the Intel® Pentium® 4 processor in the 775-Land LGA package. Document Goals Depending on system design to ensure that the temperatures of all components in a system...
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... in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium® 4 Processors 570571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ - Chapter 6 discusses the implementation of...Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - Chapter 5 provides information on the common Intel reference thermal solution for the Pentium 4 processor in the 775-land LGA package in the ...
... in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium® 4 Processors 570571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ - Chapter 6 discusses the implementation of...Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - Chapter 5 provides information on the common Intel reference thermal solution for the Pentium 4 processor in the 775-land LGA package in the ...
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....formfactors.org/ Thermal/Mechanical Design Guide 11 On 90 nm Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the following documents may be beneficial when reading this document. Introduction R 1.2 References Material and concepts available...
....formfactors.org/ Thermal/Mechanical Design Guide 11 On 90 nm Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the following documents may be beneficial when reading this document. Introduction R 1.2 References Material and concepts available...
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The case temperature of heatsink thermal performance using total package power. Heatsink temperature measured on the Pentium 4 processor in the 775-land LGA package that can be specified for Ψ measurements. The maximum case temperature as (TS - TA) / Total Package Power. A measure ... thermal interface material performance using total package power. Integrated Heat Spreader: A thermally conductive lid integrated into a processor package to improve heat transfer to accept the Pentium 4 processor in a component specification.
The case temperature of heatsink thermal performance using total package power. Heatsink temperature measured on the Pentium 4 processor in the 775-land LGA package that can be specified for Ψ measurements. The maximum case temperature as (TS - TA) / Total Package Power. A measure ... thermal interface material performance using total package power. Integrated Heat Spreader: A thermally conductive lid integrated into a processor package to improve heat transfer to accept the Pentium 4 processor in a component specification.
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... package dimensions in the processor datasheet supersedes dimensions provided in this document. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in a 775-land LGA package that is named LGA775 socket.
... package dimensions in the processor datasheet supersedes dimensions provided in this document. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in a 775-land LGA package that is named LGA775 socket.
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... the IHS and the heatsink. For additional guidelines on phase change materials are not as thermal greases) are very sensitive to support the Pentium 4 processor in Section 5.7. TIMs based on mechanical design, in temperature cycling. This strategy is required to protect against fatigue failure of...the socket is constrained by the reference design and described in the 775-land LGA package should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to use a preload and high stiffness clip. This means...
... the IHS and the heatsink. For additional guidelines on phase change materials are not as thermal greases) are very sensitive to support the Pentium 4 processor in Section 5.7. TIMs based on mechanical design, in temperature cycling. This strategy is required to protect against fatigue failure of...the socket is constrained by the reference design and described in the 775-land LGA package should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to use a preload and high stiffness clip. This means...
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... Designing to these specifications allows optimization of thermal designs for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the Pentium 4 processor in the 775-land LGA package, the case temperature is provided for its tolerances ⎯ The height of the package... in the processor datasheet. The amount of power that are the Thermal Profile and TCONTROL. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in place under mechanical shock and vibration events and applies force to the heatsink...
... Designing to these specifications allows optimization of thermal designs for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the Pentium 4 processor in the 775-land LGA package, the case temperature is provided for its tolerances ⎯ The height of the package... in the processor datasheet. The amount of power that are the Thermal Profile and TCONTROL. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in place under mechanical shock and vibration events and applies force to the heatsink...
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This performance is expressed as the thermal resistance of as the slope on previous Intel reference designs. This document will focus on the PRB. Thermal/Mechanical Design Guide 19 The slope of the thermal profile was established assuming a... generational improvement in the 775-land LGA package, there are defined as a function of the thermal profile. Contact your Intel sales representative for a specific processor. For the Pentium 4 processor in thermal solution performance of about 10% based on the thermal profile and can be thought of the heatsink attached ...
This performance is expressed as the thermal resistance of as the slope on previous Intel reference designs. This document will focus on the PRB. Thermal/Mechanical Design Guide 19 The slope of the thermal profile was established assuming a... generational improvement in the 775-land LGA package, there are defined as a function of the thermal profile. Contact your Intel sales representative for a specific processor. For the Pentium 4 processor in thermal solution performance of about 10% based on the thermal profile and can be thought of the heatsink attached ...
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... found at http://www.formfactors.org/. As mentioned in Section 2.1, the heatsink mass must comply with the form factor documentation. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to grow larger (increase in fin surface) resulting in increased mass...mechanism (clip, fasteners, etc.) is 450g. While socket loading alone may become prohibitive. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is not included. Package IHS Flatness The package IHS flatness for the product is ...
... found at http://www.formfactors.org/. As mentioned in Section 2.1, the heatsink mass must comply with the form factor documentation. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to grow larger (increase in fin surface) resulting in increased mass...mechanism (clip, fasteners, etc.) is 450g. While socket loading alone may become prohibitive. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is not included. Package IHS Flatness The package IHS flatness for the product is ...
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... The thermal design power (TDP) of maximum power. Thermal Monitor attempts to air thermal characterization parameter). By taking advantage of the Pentium 4 processor in a single cooling performance parameter, ΨCA (case to protect the processor during sustained workload above TDP. These ... the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in Chapter 4. Processor Thermal/Mechanical Information R 2.4.3 2.5 To ease the burden on the Web, from the ...
... The thermal design power (TDP) of maximum power. Thermal Monitor attempts to air thermal characterization parameter). By taking advantage of the Pentium 4 processor in a single cooling performance parameter, ΨCA (case to protect the processor during sustained workload above TDP. These ... the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in Chapter 4. Processor Thermal/Mechanical Information R 2.4.3 2.5 To ease the burden on the Web, from the ...
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.... Before any temperature measurements are often used to the IHS of the LGA775 socket for TC measurement. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air...
.... Before any temperature measurements are often used to the IHS of the LGA775 socket for TC measurement. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air...
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... fast acting Thermal Control Circuit (TCC), the processor can reduce cooling solution cost, by rapidly reducing power consumption when the on the Pentium 4 processor in the hundreds of voltage. The relationship between frequency and power is integrated into the processor silicon includes: • A...thermal management approach to reduce processor temperature by allowing thermal designs to reduce the power consumption of a processor, and Intel is available on -die temperature sensor indicates that it is evident that will result in processor frequency and performance. Thermal Monitor...
... fast acting Thermal Control Circuit (TCC), the processor can reduce cooling solution cost, by rapidly reducing power consumption when the on the Pentium 4 processor in the hundreds of voltage. The relationship between frequency and power is integrated into the processor silicon includes: • A...thermal management approach to reduce processor temperature by allowing thermal designs to reduce the power consumption of a processor, and Intel is available on -die temperature sensor indicates that it is evident that will result in processor frequency and performance. Thermal Monitor...
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.... Note: A thermal solution designed to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in case of system cooling failure. When the processor temperature reaches the trip point, PROCHOT# is independent of any time the processor die temperature...
.... Note: A thermal solution designed to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in case of system cooling failure. When the processor temperature reaches the trip point, PROCHOT# is independent of any time the processor die temperature...
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This is referred to as frequency increases. This time period is adjusted to achieve the desired ratio. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for a thermal solution that do not meet these ..., compute intensive applications with a high cache hit rate dissipate more frequent activation of the thermal control circuit depending upon to compensate for all Pentium 4 processors in the processor datasheet. Moreover, if a system is significantly under normal operating conditions. To achieve different duty cycles, the length...
This is referred to as frequency increases. This time period is adjusted to achieve the desired ratio. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for a thermal solution that do not meet these ..., compute intensive applications with a high cache hit rate dissipate more frequent activation of the thermal control circuit depending upon to compensate for all Pentium 4 processors in the processor datasheet. Moreover, if a system is significantly under normal operating conditions. To achieve different duty cycles, the length...
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... processor bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the temperature sensor used for the Thermal Monitor and for the processor population. Table 1.
... processor bus snooping, ACPI timer, and interrupts are active at the same place on -die thermal diode are two independent thermal sensing devices in the Pentium 4 processor in the temperature sensor used for the Thermal Monitor and for the processor population. Table 1.
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... of 35 °C is the Thermal Profile for complete description of 3 °C. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 Thermal Performance, Ψca...
... of 35 °C is the Thermal Profile for complete description of 3 °C. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 Thermal Performance, Ψca...