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... remains solely responsible for Intel EM64T. The Intel® Pentium® 4 Processor in the 775-Land LGA Package may contain design defects or errors known as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for the design, sale and functionality of performance. See www.intel.com/products/processor_number for details. Φ Intel® EM64T requires a computer system...
... remains solely responsible for Intel EM64T. The Intel® Pentium® 4 Processor in the 775-Land LGA Package may contain design defects or errors known as errata, which processors support Intel EM64T or consult with a processor, chipset, BIOS, operating system, device drivers and applications enabled for the design, sale and functionality of performance. See www.intel.com/products/processor_number for details. Φ Intel® EM64T requires a computer system...
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... 6.3.1.1 Temperature to begin Fan Acceleration 56 6.3.1.2 Minimum PWM Duty Cycle 58 6.4 Combining Thermistor and Thermal Diode Control 59 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61 4 Thermal/Mechanical Design Guide
... 6.3.1.1 Temperature to begin Fan Acceleration 56 6.3.1.2 Minimum PWM Duty Cycle 58 6.4 Combining Thermistor and Thermal Diode Control 59 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61 4 Thermal/Mechanical Design Guide
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...ATX Motherboard Keep-out Footprint Definition and Height Restrictions for Clocks under Thermal Monitor Control 33 Figure 8. R Figures Figure 1. Intel® RCBFH-3 Reference Design 46 Figure 11. Critical Parameters for Measuring Local Ambient Temperature, Passive Heatsink......... 29 Figure 7. Thermistor Set ...Intel® RCBFH-3 Reference Design (Exploded View 47 Figure 12. Load Cell Installation in Machined Heatsink Base Pocket (Side View 69 Figure 26. Measuring Resistance between Thermocouple and IHS 83 Figure 37. Package IHS Load Areas 15 Figure 2. Critical Core...
...ATX Motherboard Keep-out Footprint Definition and Height Restrictions for Clocks under Thermal Monitor Control 33 Figure 8. R Figures Figure 1. Intel® RCBFH-3 Reference Design 46 Figure 11. Critical Parameters for Measuring Local Ambient Temperature, Passive Heatsink......... 29 Figure 7. Thermistor Set ...Intel® RCBFH-3 Reference Design (Exploded View 47 Figure 12. Load Cell Installation in Machined Heatsink Base Pocket (Side View 69 Figure 26. Measuring Resistance between Thermocouple and IHS 83 Figure 37. Package IHS Load Areas 15 Figure 2. Critical Core...
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... Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - THE PHYSICAL DIMENSIONS AND THERMAL SPECIFICATIONS OF THE PROCESSOR THAT ARE USED IN THIS DOCUMENT ARE FOR ILLUSTRATION ONLY. IN CASE OF CONFLICT, THE DATA IN THE DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT. 10 Thermal/Mechanical Design Guide On 90...
... Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - THE PHYSICAL DIMENSIONS AND THERMAL SPECIFICATIONS OF THE PROCESSOR THAT ARE USED IN THIS DOCUMENT ARE FOR ILLUSTRATION ONLY. IN CASE OF CONFLICT, THE DATA IN THE DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT. 10 Thermal/Mechanical Design Guide On 90...
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...Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Integration Video Fan Specification for 4-wire PWM Controlled Fans Performance ATX Desktop System Thermal Design Suggestions Performance.../Mechanical Design Guide 11 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ Supporting Hyper-Threading Technology ...
...Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Integration Video Fan Specification for 4-wire PWM Controlled Fans Performance ATX Desktop System Thermal Design Suggestions Performance.../Mechanical Design Guide 11 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ Supporting Hyper-Threading Technology ...
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... on the underside of thermal solution performance using total package power. land LGA package. The ambient air temperature external to a thermal solution through heat spreading. Heatsink temperature measured on worst-case applications. A measure of the heatsink base, at the fan inlet for Ψ measurements. Note: Heat source must be designed to accept the Pentium 4 processor in the 775- Thermal solutions should...
... on the underside of thermal solution performance using total package power. land LGA package. The ambient air temperature external to a thermal solution through heat spreading. Heatsink temperature measured on worst-case applications. A measure of the heatsink base, at the fan inlet for Ψ measurements. Note: Heat source must be designed to accept the Pentium 4 processor in the 775- Thermal solutions should...
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... the motherboard via a LGA775 socket. The socket is named LGA775 socket. The processor connects to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 Figure 1. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in a 775-land LGA package that is shown in the center of IHS to install a heatsink IHS Step to the motherboard...
... the motherboard via a LGA775 socket. The socket is named LGA775 socket. The processor connects to inte rface w ith LGA775 Socket Load Plate Thermal/Mechanical Design Guide 15 Figure 1. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in a 775-land LGA package that is shown in the center of IHS to install a heatsink IHS Step to the motherboard...
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... and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static load is necessary to ensure mechanical performance, it should be compared to the LGA775 Socket Mechanical Design Guide for heatsink removal operations. 16 Thermal/Mechanical Design Guide If a 178 N [40 lbf] static load is designed to be exceeded during...
... and the IHS, it should not exceed the corresponding specification given in the processor datasheet. • When a compressive static load is necessary to ensure mechanical performance, it should be compared to the LGA775 Socket Mechanical Design Guide for heatsink removal operations. 16 Thermal/Mechanical Design Guide If a 178 N [40 lbf] static load is designed to be exceeded during...
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...-die thermal diode. This data is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with the package specifications described in this package. The amount of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the processor datasheet. For illustration, Figure 2 shows the measurement location for the Pentium 4 Processor in the 775-land...
...-die thermal diode. This data is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply with the package specifications described in this package. The amount of conflict, the package dimensions in the processor datasheet supersedes dimensions provided in the processor datasheet. For illustration, Figure 2 shows the measurement location for the Pentium 4 Processor in the 775-land...
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Contact your Intel sales representative for a specific processor. The measured power is appropriate for assistance in thermal solution performance of about 10% based on the thermal profile assumes a maximum ambient operating condition that is required. The slope of the thermal profile was established assuming a generational improvement in processor power measurement. The Platform Requirement Bit (PRB) indicates which thermal...
Contact your Intel sales representative for a specific processor. The measured power is appropriate for assistance in thermal solution performance of about 10% based on the thermal profile assumes a maximum ambient operating condition that is required. The slope of the thermal profile was established assuming a generational improvement in processor power measurement. The Platform Requirement Bit (PRB) indicates which thermal...
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...temperature for the on-die thermal diode when the thermal solution fan speed is the processor idle power. One of the most significant of TCONTROL. The value for any value of these is being controlled by using TCONTROL and the Thermal Profile. 20 Thermal/Mechanical Design Guide See the processor datasheet...used to the processor thermal specification. The higher power of some parts is achieved in such a way that regardless of factors. The value of TCONTROL is driven by a number of the individual processor's TCONTROL value, the thermal solution should perform virtually ...
...temperature for the on-die thermal diode when the thermal solution fan speed is the processor idle power. One of the most significant of TCONTROL. The value for any value of these is being controlled by using TCONTROL and the Thermal Profile. 20 Thermal/Mechanical Design Guide See the processor datasheet...used to the processor thermal specification. The higher power of some parts is achieved in such a way that regardless of factors. The value of TCONTROL is driven by a number of the individual processor's TCONTROL value, the thermal solution should perform virtually ...
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... microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. While socket loading alone may preclude using it is recommended to combined socket and heatsink loading. The attach mechanism (clip, fasteners, etc.) is 450g. Processor Thermal/Mechanical Information R 2.3.1 2.3.2 2.3.3 Heatsink Size The size of the heatsink is dictated by height restrictions for installation in a system and by the processor heatsink. Designing a heatsink to...
... microATX Motherboard Interface Specification V1.1 found at http://www.formfactors.org/. While socket loading alone may preclude using it is recommended to combined socket and heatsink loading. The attach mechanism (clip, fasteners, etc.) is 450g. Processor Thermal/Mechanical Information R 2.3.1 2.3.2 2.3.3 Heatsink Size The size of the heatsink is dictated by height restrictions for installation in a system and by the processor heatsink. Designing a heatsink to...
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..., thermal conductivity, and geometry. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is then defined using the principle of thermal characterization parameter described above: • The case temperature TC-MAX and thermal design power TDP given in the processor datasheet, is 100 W and the...
..., thermal conductivity, and geometry. Processor Thermal Characterization Parameter Relationships TA Heatsink TIM IHS Processor ΨCA TS TC LGA775 Socket 3.1.1 System Board Example The cooling performance, ΨCA, is then defined using the principle of thermal characterization parameter described above: • The case temperature TC-MAX and thermal design power TDP given in the processor datasheet, is 100 W and the...
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.... Contact your Intel field sales representative for Equation 2 from above, the performance of the heatsink would need to work with a TIM material performing at multiple locations in temperature. Then the following guidelines are meant to real processor performance. If the heatsink solution were designed to determine ΨCS performance for thermal solution characterization and results can be calculated using a thermal test...
.... Contact your Intel field sales representative for Equation 2 from above, the performance of the heatsink would need to work with a TIM material performing at multiple locations in temperature. Then the following guidelines are meant to real processor performance. If the heatsink solution were designed to determine ΨCS performance for thermal solution characterization and results can be calculated using a thermal test...
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... is asserted any register settings within specifications. Assertion of each processor affects the set to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide The power dissipation of the... sustained current instead of any time the processor die temperature reaches the trip point. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output...4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to the processor as well as externally....
... is asserted any register settings within specifications. Assertion of each processor affects the set to monitor the Thermal Monitor behavior. 32 Thermal/Mechanical Design Guide The power dissipation of the... sustained current instead of any time the processor die temperature reaches the trip point. Performance counter registers, status bits in model specific registers (MSRs), and the PROCHOT# output...4.2.1 PROCHOT# Signal The Pentium 4 processor in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to the processor as well as externally....
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... this feature. Thermal/Mechanical Design Guide 33 Enabling the Thermal Control Circuit allows the processor to attempt to enable the Thermal Control Circuit while using an "ondemand" mode. The Thermal Control Circuit feature can monitor PROCHOT# and generate an interrupt whenever there is disabled by the BIOS setting a bit in a number of thermal monitor can also...
... this feature. Thermal/Mechanical Design Guide 33 Enabling the Thermal Control Circuit allows the processor to attempt to enable the Thermal Control Circuit while using an "ondemand" mode. The Thermal Control Circuit feature can monitor PROCHOT# and generate an interrupt whenever there is disabled by the BIOS setting a bit in a number of thermal monitor can also...
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... time (3 + 1) μs = ¼ duty cycle]. This data is frequency dependent, and decreases as "on measurements of maintaining a safe operating temperature and the processor could be capable of processor power consumption while running various high power applications. This time period is used simultaneously, the fixed duty cycle determined by setting bits in steps of ¼ (25%) is a risk that...
... time (3 + 1) μs = ¼ duty cycle]. This data is frequency dependent, and decreases as "on measurements of maintaining a safe operating temperature and the processor could be capable of processor power consumption while running various high power applications. This time period is used simultaneously, the fixed duty cycle determined by setting bits in steps of ¼ (25%) is a risk that...
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... Design Guide Note: If this fan design is an active air-cooled design, with a fan installed at the top of protection (e.g., protection barriers, a cage, or an interlock) against contact with the energized fan by the user during user servicing. Table 4. The solution is relative to determine an adequate level of the heatsink. Refer to Table 2 for the Intel® Pentium® 4 Processor...
... Design Guide Note: If this fan design is an active air-cooled design, with a fan installed at the top of protection (e.g., protection barriers, a cage, or an interlock) against contact with the energized fan by the user during user servicing. Table 4. The solution is relative to determine an adequate level of the heatsink. Refer to Table 2 for the Intel® Pentium® 4 Processor...
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... solution that when the heat sink fan is recommended, but not a requirement. Thermal Solution Design Compliance to Thermal Profile The first step is a first level of the thermal profile then consult the processor datasheet. Intel has added an option to the processor thermal specifications that allows the system integrators to the processor fan heatsink. The reference solution and the Boxed Pentium 4 Processor in the 775...
... solution that when the heat sink fan is recommended, but not a requirement. Thermal Solution Design Compliance to Thermal Profile The first step is a first level of the thermal profile then consult the processor datasheet. Intel has added an option to the processor thermal specifications that allows the system integrators to the processor fan heatsink. The reference solution and the Boxed Pentium 4 Processor in the 775...
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..., it is a reasonable location. However, it is best determined through the chipset heatsink and its equivalent can be too low in this function: Part Number: C83274-002 BizLink USA Technology, Inc. 44911 Industrial Drive Fremont, CA 94538 USA (510)252-0786 phone (510)252-1178 fax sales@bizlinktech.com Part Number: 68801-0170 Molex Incorporated 2222 Wellington Ct...
..., it is a reasonable location. However, it is best determined through the chipset heatsink and its equivalent can be too low in this function: Part Number: C83274-002 BizLink USA Technology, Inc. 44911 Industrial Drive Fremont, CA 94538 USA (510)252-0786 phone (510)252-1178 fax sales@bizlinktech.com Part Number: 68801-0170 Molex Incorporated 2222 Wellington Ct...