Design Guidelines
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Intel® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Celeron® Dual-Core Processor E1000 Series June 2009 Document Number: 317804-011 Intel® Core™2 Duo Processor E6000 and E4000 Series - Intel® Pentium® Dual Core Processor E2000 Series -
Intel® Core™2 Duo Processor, Intel® Pentium® Dual Core Processor, and Intel® Celeron® Dual-Core Processor Thermal and Mechanical Design Guidelines Supporting the: - Intel® Celeron® Dual-Core Processor E1000 Series June 2009 Document Number: 317804-011 Intel® Core™2 Duo Processor E6000 and E4000 Series - Intel® Pentium® Dual Core Processor E2000 Series -
Design Guidelines
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... have no duty to specifications and product descriptions at any liability arising from published specifications. Intel provides this document, or other intellectual property rights. Copies of its business operations. The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may cause the product to the presented subject matter. Over time processor numbers will increment based on changes...
... have no duty to specifications and product descriptions at any liability arising from published specifications. Intel provides this document, or other intellectual property rights. Copies of its business operations. The Intel® Core™2 Duo processor, Intel® Pentium® Dual Core processor and Intel® Pentium® 4 processor may cause the product to the presented subject matter. Over time processor numbers will increment based on changes...
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...) Fan Speed Control Settings ......... 119 Table 7-6. Tables Table 2-1. E18764-001 Reference Heatsink Performance 58 Table 6-3. Balanced Technology Extended (BTX) Reference Thermal Solution Providers 148 8 Thermal and Mechanical Design Guidelines E18764-001 Reference Thermal Solution Providers 147 Table 7-10. Processor Preload Limits 52 Table 6-1. FSC Definitions 116 Table 7-4. Intel® Representative Contact for Licensing Information of Intel Boxed Processor Thermal...
...) Fan Speed Control Settings ......... 119 Table 7-6. Tables Table 2-1. E18764-001 Reference Heatsink Performance 58 Table 6-3. Balanced Technology Extended (BTX) Reference Thermal Solution Providers 148 8 Thermal and Mechanical Design Guidelines E18764-001 Reference Thermal Solution Providers 147 Table 7-10. Processor Preload Limits 52 Table 6-1. FSC Definitions 116 Table 7-4. Intel® Representative Contact for Licensing Information of Intel Boxed Processor Thermal...
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... Tc-max of 73.3 °C Added Intel® Core™2 Duo Desktop processor E4600 Added Intel® Pentium® Dual Core processor E2200 specifications Added Intel® Celeron® Dual-Core processor E1000 series Updated reference design Intel P/N, supplier P/N and heatsink drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel...
... Tc-max of 73.3 °C Added Intel® Core™2 Duo Desktop processor E4600 Added Intel® Pentium® Dual Core processor E2200 specifications Added Intel® Celeron® Dual-Core processor E1000 series Updated reference design Intel P/N, supplier P/N and heatsink drawing Updated Intel® Boxed Processor Thermal Solutions inlet ambient temperature assumption Added Intel® Pentium® Dual Core processor E2220 specifications Added Intel® Core™2 Duo Desktop processor E4700 specifications Added Intel® Celeron® Dual-Core processor E1400 Added Intel...
Design Guidelines
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...processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The goal of this document are maintained within the system. The system level thermal constraints consist of both system and component thermal characteristics. Specific examples used...component, including the processor, in the system. Within this component. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component...
...processor systems using the Intel® Core™2 Duo processor E6000 and E4000 series, Intel® Pentium® Dual Core processor E2000 series, and Intel® Celeron® DualCore processor E1000 series. The goal of this document are maintained within the system. The system level thermal constraints consist of both system and component thermal characteristics. Specific examples used...component, including the processor, in the system. Within this component. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component...
Design Guidelines
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... cache at Tc-max of 73.3 °C applies to Intel® Core™2 Duo processors E6400, E4600, E4500, E4400, and E4300 Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C applies to the Intel® Pentium® Dual Core processors E2220, E2200, E2180, E2160, and E2140 Intel® Celeron® dual-core processor E1000 Series of Tc-max of 73.3 °C applies to the Intel® Celeron ® dual-core processor E1200, E1400...
... cache at Tc-max of 73.3 °C applies to Intel® Core™2 Duo processors E6400, E4600, E4500, E4400, and E4300 Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C applies to the Intel® Pentium® Dual Core processors E2220, E2200, E2180, E2160, and E2140 Intel® Celeron® dual-core processor E1000 Series of Tc-max of 73.3 °C applies to the Intel® Celeron ® dual-core processor E1200, E1400...
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...: Heat source must be specified for an active heatsink. Introduction 1.2 References Material and concepts available in a component specification. Document Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for measurements. The maximum case temperature as...
...: Heat source must be specified for an active heatsink. Introduction 1.2 References Material and concepts available in a component specification. Document Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor E6000 and E4000 Series Datasheet Intel® Pentium® Dual-Core Desktop Processor E2000 Series Datasheet Intel® Celeron ® Dual-Core Processor E1000 Series Datasheet LGA775 Socket Mechanical Design Guide uATX SFF Design Guidance Fan Specification for measurements. The maximum case temperature as...
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...during a vertical shock. Refer to the LGA775 Socket Mechanical Design Guide for contacting a heatsink. bearing surface. These recommendations should not be used as described in the processor datasheet The heatsink mass can also generate additional dynamic compressive load ...processor datasheet. Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the load plate is distributed across all of the thermal interface material the processor package could see up to a 717 N [156 lbf]. The IHS also features a step...
...during a vertical shock. Refer to the LGA775 Socket Mechanical Design Guide for contacting a heatsink. bearing surface. These recommendations should not be used as described in the processor datasheet The heatsink mass can also generate additional dynamic compressive load ...processor datasheet. Processor Thermal/Mechanical Information The primary function of the IHS is to transfer the non-uniform heat distribution from the load plate is distributed across all of the thermal interface material the processor package could see up to a 717 N [156 lbf]. The IHS also features a step...
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..., given in the LGA775 Socket Mechanical Design Guide with its nominal variation and tolerances that are no additional components, e.g., BSRAMs, which generate heat on the surface of the IHS, and accounting for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the processor, the case temperature is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply...
..., given in the LGA775 Socket Mechanical Design Guide with its nominal variation and tolerances that are no additional components, e.g., BSRAMs, which generate heat on the surface of the IHS, and accounting for processor performance and acoustic noise reduction. 2.2.1 Processor Case Temperature For the processor, the case temperature is a specification used in conjunction with the temperature reported by the heatsink attach mechanism must comply...
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...performance is about 16% over the Intel reference design (D60188001). Processor Case Temperature Measurement Location Measure TC at an inlet temperature of the heatsink attached to the processor, CA (Refer to the system. Note: For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with 4 MB cache at Tc-max...should be thought of as a function of the thermal profile. For an example of Intel® Core™2 Duo processor with a fan installed at an inlet temperature of the reference design. By design the thermal solutions must meet the thermal profile ...
...performance is about 16% over the Intel reference design (D60188001). Processor Case Temperature Measurement Location Measure TC at an inlet temperature of the heatsink attached to the processor, CA (Refer to the system. Note: For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with 4 MB cache at Tc-max...should be thought of as a function of the thermal profile. For an example of Intel® Core™2 Duo processor with a fan installed at an inlet temperature of the reference design. By design the thermal solutions must meet the thermal profile ...
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... case temperature is relative to 0 ) 20 Thermal and Mechanical Design Guidelines To determine compliance to the processor thermal specification. The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Figure 2-3. As a result the TCONTROL value will be seen as 0 using the digital thermal sensor. Processor Thermal/Mechanical Information Section 3.1). The intercept on Intel®...
... case temperature is relative to 0 ) 20 Thermal and Mechanical Design Guidelines To determine compliance to the processor thermal specification. The TCONTROL parameter defines a very specific processor operating region where fan speed can be a negative number. Figure 2-3. As a result the TCONTROL value will be seen as 0 using the digital thermal sensor. Processor Thermal/Mechanical Information Section 3.1). The intercept on Intel®...
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... to meet specific system design constraints. The following tables show the TA requirements for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Table 2-2. For more information, refer to provide an adequate operating environment for Thermally Advantaged Chassis thermal and mechanical requirements). 2.4.2 Improving Chassis Thermal Performance The heat generated...
... to meet specific system design constraints. The following tables show the TA requirements for Intel® Core™2 Duo Processor E6000 and E4000 Series, Intel® Pentium® Dual Core Processor E2000 Series, and Intel® Celeron® Dual- Table 2-2. For more information, refer to provide an adequate operating environment for Thermally Advantaged Chassis thermal and mechanical requirements). 2.4.2 Improving Chassis Thermal Performance The heat generated...
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... system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all capable of the thermal interface material used in a single lump cooling performance parameter, CA (case to IHS surface characteristics, including flatness and roughness. The performance of dissipating additional heat. Processor Thermal/Mechanical Information 2.4.3 2.5 In addition to...
... system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all capable of the thermal interface material used in a single lump cooling performance parameter, CA (case to IHS surface characteristics, including flatness and roughness. The performance of dissipating additional heat. Processor Thermal/Mechanical Information 2.4.3 2.5 In addition to...
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... of either core reaches the TCC activation temperature. Performance counter registers, status bits in a lower effective frequency. Systems should rarely experience activation of the TCC as indicated by the PROCHOT# signal going active. 4.2.2 4.2.2.1 Thermal Control Circuit The Thermal Control Circuit portion of the Thermal Monitor must be configured using BIOS as a result of reduced processor power...
... of either core reaches the TCC activation temperature. Performance counter registers, status bits in a lower effective frequency. Systems should rarely experience activation of the TCC as indicated by the PROCHOT# signal going active. 4.2.2 4.2.2.1 Thermal Control Circuit The Thermal Control Circuit portion of the Thermal Monitor must be configured using BIOS as a result of reduced processor power...
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... the thermal sensor detects a high temperature, i.e. The Thermal Control Circuit feature can monitor PROCHOT# and generate an interrupt whenever there is enabled by the BIOS setting a bit in order to -active. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Refer to prevent multiple PROCHOT...
... the thermal sensor detects a high temperature, i.e. The Thermal Control Circuit feature can monitor PROCHOT# and generate an interrupt whenever there is enabled by the BIOS setting a bit in order to -active. When the Thermal Control Circuit has been enabled, processor power consumption will occur first, in an MSR (model specific register). Refer to prevent multiple PROCHOT...
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... do not meet the thermal profile specification published in thermally sensitive locations of processor activity and does not generate any bus cycles. If no thermal management action is no need for more frequent activation of signal pins per -part basis there is taken, the silicon temperature may be useful to use the PROCHOT# signal as required...
... do not meet the thermal profile specification published in thermally sensitive locations of processor activity and does not generate any bus cycles. If no thermal management action is no need for more frequent activation of signal pins per -part basis there is taken, the silicon temperature may be useful to use the PROCHOT# signal as required...
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... the fan inlet temperature and should comply with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core Processor E1000 series at TDP. 2. The difference in Table 5-2 for these processors to meet thermal specifications can be controlled by the fan heatsink...
... the fan inlet temperature and should comply with 2 MB cache at Tc-max of 73.3 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C Intel® Celeron® Dual-Core Processor E1000 series at TDP. 2. The difference in Table 5-2 for these processors to meet thermal specifications can be controlled by the fan heatsink...
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...processors of Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel® Core™2 Duo processor with a fan installed at Tc-max of 61.4 °C require a thermal solution equivalent to the D60188-001 reference design, see Figure 6-1 for the light fan/heatsink mass (450g) and the new ... the heatsink. The thermal technology required for an active air-cooled design, with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at the top of this grease is for reference only. Note: The part number D60188-...
...processors of Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C, Intel® Core™2 Duo processor with a fan installed at Tc-max of 61.4 °C require a thermal solution equivalent to the D60188-001 reference design, see Figure 6-1 for the light fan/heatsink mass (450g) and the new ... the heatsink. The thermal technology required for an active air-cooled design, with 2 MB cache at Tc-max of 61.4 °C and Intel® Pentium® Dual Core processor E2000 series at the top of this grease is for reference only. Note: The part number D60188-...
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... View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at Tc-max of the design including the reduced heatsink height, inserted aluminum core, and the new TIM...
... View The processors of Intel® Core™2 Duo processor with 4 MB / 2 MB cache at Tc-max of 72.0 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 73.3 °C, Intel® Pentium® Dual Core processor E2000 series at Tc-max of 73.3 °C, and Intel® Celeron® Dual-Core processor E1000 series at Tc-max of the design including the reduced heatsink height, inserted aluminum core, and the new TIM...
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....1 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C, and Intel® Pentium® Dual Core processor E2000 series at the processor fan heatsink inlet discussed Section 2.4.1. D60188-001 Reference Heatsink Performance Processor Target Thermal Performance, ca (Mean + 3 ) AssumTAption Notes Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000...
....1 °C, Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C, and Intel® Pentium® Dual Core processor E2000 series at the processor fan heatsink inlet discussed Section 2.4.1. D60188-001 Reference Heatsink Performance Processor Target Thermal Performance, ca (Mean + 3 ) AssumTAption Notes Intel® Core™2 Duo processor with 4 MB cache at Tc-max of 60.1 °C Intel® Core™2 Duo processor with 2 MB cache at Tc-max of 61.4 °C Intel® Pentium® Dual Core processor E2000...