P8H61-M LX3 PLUS R2.0 User's Manual
Page 12
...graphics, multimedia, and Internet applications. It is supported by complete backward compatibility with the convenience and seamless transition offerred by Intel® 3rd generation Core™ processors. 8-channel high definition audio The onboard 8-channel HD audio (High... systems. 100% All High-quality Conductive Polymer Capacitors (P8H61-M LX3 PLUS R2.0 only) This motherboard uses all high-quality conductive polymer capacitors for durability, improved lifespan, and enhanced thermal capacity. 1-2 ASUS P8H61-M LX3 R2.0 Series Intel® H61 Express Chipset The Intel®...
...graphics, multimedia, and Internet applications. It is supported by complete backward compatibility with the convenience and seamless transition offerred by Intel® 3rd generation Core™ processors. 8-channel high definition audio The onboard 8-channel HD audio (High... systems. 100% All High-quality Conductive Polymer Capacitors (P8H61-M LX3 PLUS R2.0 only) This motherboard uses all high-quality conductive polymer capacitors for durability, improved lifespan, and enhanced thermal capacity. 1-2 ASUS P8H61-M LX3 R2.0 Series Intel® H61 Express Chipset The Intel®...
P8H61-M LX3 PLUS R2.0 User's Manual
Page 21
... to secure the heatsink and fan assembly in a push-pin design and requires no tool to install. • Use an LGA1155-compatible CPU heatsink and fan assembly only. If you purchased a separate CPU heatsink and fan assembly, ensure that you have properly applied Thermal...The illustration above is for reference only. Chapter 1: Product introduction 1-11 1.6.2 Installing the CPU heatsink and fan The Intel® LGA1155 processor requires a specially designed heatsink and fan assembly to ensure optimum thermal condition and performance. • When you use only Intel®‑...
... to secure the heatsink and fan assembly in a push-pin design and requires no tool to install. • Use an LGA1155-compatible CPU heatsink and fan assembly only. If you purchased a separate CPU heatsink and fan assembly, ensure that you have properly applied Thermal...The illustration above is for reference only. Chapter 1: Product introduction 1-11 1.6.2 Installing the CPU heatsink and fan The Intel® LGA1155 processor requires a specially designed heatsink and fan assembly to ensure optimum thermal condition and performance. • When you use only Intel®‑...
P8H61-M LX3 PLUS R2.0 User's Manual
Page 24
P8H61-M LX3 R2.0 Series Motherboard Qualified Vendors Lists (QVL) DDR3-2400 (O.C.) MHz capability Vendors Part No. Use a maximum of 3GB system memory if you are using a 32-bit ... by Intel® 3rd generation processors. 1-14 ASUS P8H61-M LX3 R2.0 Series The system maps the total size of the lower-sized channel for the OS can be about 3GB or less. For effective use a more efficient memory cooling system to support a full memory load (2 DIMMs) or overclocking condition. For optimum compatibility, we recommend that you...
P8H61-M LX3 R2.0 Series Motherboard Qualified Vendors Lists (QVL) DDR3-2400 (O.C.) MHz capability Vendors Part No. Use a maximum of 3GB system memory if you are using a 32-bit ... by Intel® 3rd generation processors. 1-14 ASUS P8H61-M LX3 R2.0 Series The system maps the total size of the lower-sized channel for the OS can be about 3GB or less. For effective use a more efficient memory cooling system to support a full memory load (2 DIMMs) or overclocking condition. For optimum compatibility, we recommend that you...
