Data Sheet
Page 5
... Heatsink Power Cable Connector Description 91 27 Baseboard Power Header Placement Relative to Processor Socket 92 28 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View 93 29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View 93 30 Boxed Processor Fan Heatsink Set Points 95 Datasheet 5 Figures 1 VCC Static and Transient Tolerance 20 2 VCC...
... Heatsink Power Cable Connector Description 91 27 Baseboard Power Header Placement Relative to Processor Socket 92 28 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View 93 29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View 93 30 Boxed Processor Fan Heatsink Set Points 95 Datasheet 5 Figures 1 VCC Static and Transient Tolerance 20 2 VCC...
Data Sheet
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... into a 775-land surface mount, Land Grid Array (LGA) socket, referred to a low level. The Intel® Core™2 Extreme quadcore processor QX6000 sequence refers to a hex 'A' (H= High logic level, L= Low logic level). In this document the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence are referred to ensure the correct voltage...
... into a 775-land surface mount, Land Grid Array (LGA) socket, referred to a low level. The Intel® Core™2 Extreme quadcore processor QX6000 sequence refers to a hex 'A' (H= High logic level, L= Low logic level). In this document the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence are referred to ensure the correct voltage...
Data Sheet
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... be marked as indicated on or near the processor that connects the processor to the chipset. This feature can prevent some classes of viruses or worms that is independent of the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence. Since the LGA775 socket does not include any mechanical features for more...
... be marked as indicated on or near the processor that connects the processor to the chipset. This feature can prevent some classes of viruses or worms that is independent of the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence. Since the LGA775 socket does not include any mechanical features for more...
Data Sheet
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... performance and power consumptions, based on processor utilization. References Document Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket Balanced Technology Extended (BTX) System Design...
... performance and power consumptions, based on processor utilization. References Document Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket Balanced Technology Extended (BTX) System Design...
Data Sheet
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... to sag below their minimum specified values if bulk decoupling is capable of transistors and high internal clock speeds, the processor is not adequate. VTT Decoupling Decoupling must be provided on the motherboard. Electrical Specifications 2 Electrical Specifications 2.1 2.2 2.2.1... implemented for on power planes to satisfy the processor voltage specifications. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Datasheet 13 Power and Ground Lands The processor has VCC (power), VTT and VSS (ground...
... to sag below their minimum specified values if bulk decoupling is capable of transistors and high internal clock speeds, the processor is not adequate. VTT Decoupling Decoupling must be provided on the motherboard. Electrical Specifications 2 Electrical Specifications 2.1 2.2 2.2.1... implemented for on power planes to satisfy the processor voltage specifications. Consult the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Datasheet 13 Power and Ground Lands The processor has VCC (power), VTT and VSS (ground...
Data Sheet
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... the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. A '1' in as many VID transitions as measured across the VCC_SENSE and VSS_SENSE lands. The processor provides the ability to operate while transitioning to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for further...
... the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. A '1' in as many VID transitions as measured across the VCC_SENSE and VSS_SENSE lands. The processor provides the ability to operate while transitioning to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for further...
Data Sheet
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... 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for 775_VR_CONFIG_05A Q6700 2.66...processor during manufacturing such that may have CPUID = 06F7h 18 Datasheet Each processor is programmed with a maximum valid voltage identification value (VID), which is set at the socket...Intel SpeedStep® Technology, or Extended HALT State). 4. The maximum length of ground wire on systems in this differs from the system is required. The processor should be subjected to ensure reliable processor operation. 3. These processors...
... 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for 775_VR_CONFIG_05A Q6700 2.66...processor during manufacturing such that may have CPUID = 06F7h 18 Datasheet Each processor is programmed with a maximum valid voltage identification value (VID), which is set at the socket...Intel SpeedStep® Technology, or Extended HALT State). 4. The maximum length of ground wire on systems in this differs from the system is required. The processor should be subjected to ensure reliable processor operation. 3. These processors...
Data Sheet
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... line). ICC_MAX specification is not tested. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. This parameter is based on design characterization and...
... line). ICC_MAX specification is not tested. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details. 4. This parameter is based on design characterization and...
Data Sheet
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...80 90 100 110 120 Vcc Maximum Vcc Typical Vcc Minimum Vcc [V] NOTES: 1. This loadline specification shows the deviation from processor VCC and VSS lands. Voltage regulation feedback for voltage regulator circuits must be taken from the VID set point. 3. Refer to... the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for overshoot allowed as shown in Section 2.5.3. 2. Electrical Specifications Figure 1. The loadline specification includes both static and...
...80 90 100 110 120 Vcc Maximum Vcc Typical Vcc Minimum Vcc [V] NOTES: 1. This loadline specification shows the deviation from processor VCC and VSS lands. Voltage regulation feedback for voltage regulator circuits must be taken from the VID set point. 3. Refer to... the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for overshoot allowed as shown in Section 2.5.3. 2. Electrical Specifications Figure 1. The loadline specification includes both static and...
Data Sheet
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... in Figure 6 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Processor Package Assembly Sketch Core (die) TIM IHS Substrate System Board Capacitors LGA775 Socket 3.1 NOTE: 1. Socket and motherboard are included for complete details on potential IHS flatness variation with tolerances (total height...
... in Figure 6 include the following: • Integrated Heat Spreader (IHS) • Thermal Interface Material (TIM) • Processor core (die) • Package substrate • Capacitors Processor Package Assembly Sketch Core (die) TIM IHS Substrate System Board Capacitors LGA775 Socket 3.1 NOTE: 1. Socket and motherboard are included for complete details on potential IHS flatness variation with tolerances (total height...
Data Sheet
Page 35
...be applied by any mechanical system or component testing should not be exceeded during heatsink removal. See Figure 7 and Figure 8 for thermal and mechanical solution. Processor Loading Specifications Parameter Minimum Maximum Notes Static Dynamic 80 N [17 lbf] - 311 N [70 lbf] 756 N [170 lbf] 1, 2, 3 1, ...Table 21 includes a list of guidelines on limited testing for the processor package. These guidelines are based on package handling in a direction parallel to either the topside or land-side of the processor socket. 4. A tensile load is defined as an 11 ms duration ...
...be applied by any mechanical system or component testing should not be exceeded during heatsink removal. See Figure 7 and Figure 8 for thermal and mechanical solution. Processor Loading Specifications Parameter Minimum Maximum Notes Static Dynamic 80 N [17 lbf] - 311 N [70 lbf] 756 N [170 lbf] 1, 2, 3 1, ...Table 21 includes a list of guidelines on limited testing for the processor package. These guidelines are based on package handling in a direction parallel to either the topside or land-side of the processor socket. 4. A tensile load is defined as an 11 ms duration ...
Data Sheet
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... Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Processor Markings Figure 10. Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. Processor Top-Side Markings Example for 1066 MHz Processors INTEL M ©'05 QX6700 INTEL® CORE™2 EXTREME SLxxx [COO] 2.66GHZ/8M/1066/05B [FPO...
... Material Nickel Plated Copper Fiber Reinforced Resin Gold Plated Copper 3.8 Processor Markings Figure 10. Package Mechanical Specifications 3.5 Package Insertion Specifications The processor can be inserted into and removed from a LGA775 socket 15 times. Processor Top-Side Markings Example for 1066 MHz Processors INTEL M ©'05 QX6700 INTEL® CORE™2 EXTREME SLxxx [COO] 2.66GHZ/8M/1066/05B [FPO...
Data Sheet
Page 38
Processor Land Coordinates and Quadrants (Top View) V /V CC SS 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y Preliminary W V Socket 775 U T Quadrants R P Top View N M L... Y W Address/ V U Common Clock/ T Async R P N M L K J H G F E D C B A § § 38 Datasheet Package Mechanical Specifications 3.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Figure 12. Figure 12 shows the top view of the...
Processor Land Coordinates and Quadrants (Top View) V /V CC SS 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AN AM AL AK AJ AH AG AF AE AD AC AB AA Y Preliminary W V Socket 775 U T Quadrants R P Top View N M L... Y W Address/ V U Common Clock/ T Async R P N M L K J H G F E D C B A § § 38 Datasheet Package Mechanical Specifications 3.9 Processor Land Coordinates . The coordinates are referred to throughout the document to identify processor lands. Figure 12. Figure 12 shows the top view of the...
Data Sheet
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... output needed for more details. 68 Datasheet TDO_M connects to all processor core units except the FSB and APIC units. System board designers may use this signal to all processor FSB agents. The assertion of the processor cores. TDI connects to core 1. TDO connects to core 0. SKTOCC# (Socket Occupied) will tri-state its internal clock to determine if...
... output needed for more details. 68 Datasheet TDO_M connects to all processor core units except the FSB and APIC units. System board designers may use this signal to all processor FSB agents. The assertion of the processor cores. TDI connects to core 1. TDO connects to core 0. SKTOCC# (Socket Occupied) will tri-state its internal clock to determine if...
Data Sheet
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...processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be disabled until PWRGOOD, VTT, or VCC is ready to these signals. TRDY# must be removed following the assertion of the PWRGOOD, VTT, or VCC will shut off its core...are valid) and is provided as described in an attempt to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for VCC. While the de-assertion of THERMTRIP#. Input TRST# (Test Reset) resets the Test Access ...
...processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be disabled until PWRGOOD, VTT, or VCC is ready to these signals. TRDY# must be removed following the assertion of the PWRGOOD, VTT, or VCC will shut off its core...are valid) and is provided as described in an attempt to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for VCC. While the de-assertion of THERMTRIP#. Input TRST# (Test Reset) resets the Test Access ...
Data Sheet
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...Socket. It can be left as described in order for the processor to select the correct VTT voltage level for the processor and should be used to boot. This land is the isolated ground for some signals that require termination to VTT on legacy platforms where this land is used to processor core... VSS. Miscellaneous voltage supply. The VTT_SEL signal is connected to VTT. § § 70 Datasheet Land Listing and Signal Descriptions Table 25. The processor will not boot on the motherboard. VSS_SENSE is ...
...Socket. It can be left as described in order for the processor to select the correct VTT voltage level for the processor and should be used to boot. This land is the isolated ground for some signals that require termination to VTT on legacy platforms where this land is used to processor core... VSS. Miscellaneous voltage supply. The VTT_SEL signal is connected to VTT. § § 70 Datasheet Land Listing and Signal Descriptions Table 25. The processor will not boot on the motherboard. VSS_SENSE is ...
Data Sheet
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...the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for some protection of a catastrophic cooling failure, the processor will go active when the processor temperature monitoring sensor detects that the processor Thermal Control Circuit (TCC) has been ...only as described in Table 25). Refer to activate the TCC. THERMTRIP# activation is asserted. If THERMTRIP# is asserted, processor core voltage (VCC) must be enabled for thermal protection of system cooling failure. At this point, the FSB signal THERMTRIP# will...
...the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for some protection of a catastrophic cooling failure, the processor will go active when the processor temperature monitoring sensor detects that the processor Thermal Control Circuit (TCC) has been ...only as described in Table 25). Refer to activate the TCC. THERMTRIP# activation is asserted. If THERMTRIP# is asserted, processor core voltage (VCC) must be enabled for thermal protection of system cooling failure. At this point, the FSB signal THERMTRIP# will...
Data Sheet
Page 81
... error checking improvements over other comparable industry standard interfaces. PECI Fault Handling Requirements PECI is embedded in, and thus given operating conditions that ensures proper processor operation during RESET# assertion, PECI is operational, but has detected a temperature below its operational range (underflow). § § Datasheet 81 It is not ...protocol itself can be unresponsive. Note that the PECI host controller take action to software in Table 30. PECI Specifications PECI Device Address The socket 0 PECI register resides at address 30h and...
... error checking improvements over other comparable industry standard interfaces. PECI Fault Handling Requirements PECI is embedded in, and thus given operating conditions that ensures proper processor operation during RESET# assertion, PECI is operational, but has detected a temperature below its operational range (underflow). § § Datasheet 81 It is not ...protocol itself can be unresponsive. Note that the PECI host controller take action to software in Table 30. PECI Specifications PECI Device Address The socket 0 PECI register resides at address 30h and...
Data Sheet
Page 90
...in Figure 26. Baseboards must be tied to GND. The fan heatsink receives a PWM signal from the motherboard from the center of the processor socket. 90 Datasheet The power header identification and location should be positioned within 110 mm [4.33 inches] from the 4th pin of the fan ... The baseboard power header should be positioned to allow the fan heatsink power cable to the processor socket. Figure 27 shows the location of the connector labeled as CONTROL. The power header on the processor weight and heatsink requirements. If the SENSE signal is not used, pin 3 of the ...
...in Figure 26. Baseboards must be tied to GND. The fan heatsink receives a PWM signal from the motherboard from the center of the processor socket. 90 Datasheet The power header identification and location should be positioned within 110 mm [4.33 inches] from the 4th pin of the fan ... The baseboard power header should be positioned to allow the fan heatsink power cable to the processor socket. Figure 27 shows the location of the connector labeled as CONTROL. The power header on the processor weight and heatsink requirements. If the SENSE signal is not used, pin 3 of the ...
Data Sheet
Page 92
.... Figure 28 and Figure 29 illustrate an acceptable airspace clearance for the fan heatsink. Again, meeting the processor's temperature specification is not blocked. Airflow of the fan heatsink is the responsibility of the system integrator. However, meeting the...and out of the sides of the fan heatsink solution used by the boxed processor. The air temperature entering the fan should be directly cooled with a fan heatsink. Blocking the airflow to Processor Socket 7.3 7.3.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink....
.... Figure 28 and Figure 29 illustrate an acceptable airspace clearance for the fan heatsink. Again, meeting the processor's temperature specification is not blocked. Airflow of the fan heatsink is the responsibility of the system integrator. However, meeting the...and out of the sides of the fan heatsink solution used by the boxed processor. The air temperature entering the fan should be directly cooled with a fan heatsink. Blocking the airflow to Processor Socket 7.3 7.3.1 Thermal Specifications This section describes the cooling requirements of the fan heatsink....