Data Sheet
Page 5
... Quadrants (Top View 38 13 land-out Diagram (Top View - Right Side 41 15 Thermal Profile for 130 W Processors 73 16 Thermal Profile for 105 W Processors 74 17 Thermal Profile 95 W Processors 75 18 Case Temperature (TC) Measurement Location 76 19 Thermal Monitor 2 Frequency and Voltage Ordering 78 20 Conceptual Fan Control on PECI...
... Quadrants (Top View 38 13 land-out Diagram (Top View - Right Side 41 15 Thermal Profile for 130 W Processors 73 16 Thermal Profile for 105 W Processors 74 17 Thermal Profile 95 W Processors 75 18 Case Temperature (TC) Measurement Location 76 19 Thermal Monitor 2 Frequency and Voltage Ordering 78 20 Conceptual Fan Control on PECI...
Data Sheet
Page 17
... reliability will not affect the long-term reliability of the processor. TC Processor case temperature See Chapter 5 See Chapter 5 °C - Excessive overshoot or undershoot on exposure to the processor. 3. If a device is returned to conditions within the...Symbol Parameter Min Max Unit Notes1,2 VCC Core voltage with respect to conditions outside the functional limits of the processor. TSTORAGE Processor storage temperature -40 85 °C 3, 4, 5 NOTES: 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications...
... reliability will not affect the long-term reliability of the processor. TC Processor case temperature See Chapter 5 See Chapter 5 °C - Excessive overshoot or undershoot on exposure to the processor. 3. If a device is returned to conditions within the...Symbol Parameter Min Max Unit Notes1,2 VCC Core voltage with respect to conditions outside the functional limits of the processor. TSTORAGE Processor storage temperature -40 85 °C 3, 4, 5 NOTES: 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications...
Data Sheet
Page 67
... symmetric agents to any time, but clocks and power must then transition monotonically to a high state. Input/ Output As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the power supplies are stable and within their specifications. 'Clean' implies that the signal will remain low (capable...
... symmetric agents to any time, but clocks and power must then transition monotonically to a high state. Input/ Output As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the power supplies are stable and within their specifications. 'Clean' implies that the signal will remain low (capable...
Data Sheet
Page 69
... power on de-assertion of a catastrophic cooling failure, the processor will shut off its core voltage (VCC) must be disabled until PWRGOOD, VTT, or VCC is an isolated low impedance connection to reduce the processor junction temperature. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for...
... power on de-assertion of a catastrophic cooling failure, the processor will shut off its core voltage (VCC) must be disabled until PWRGOOD, VTT, or VCC is an isolated low impedance connection to reduce the processor junction temperature. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for...
Data Sheet
Page 71
... (PECI) bus as indicated by PROCHOT# (see Section 1.2). Systems that implement fan speed control must be designed such that the processor remains within the system. Intel has developed a methodology for managing processor temperatures which is based on designing a component level thermal solution, refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 5.2). Component...
... (PECI) bus as indicated by PROCHOT# (see Section 1.2). Systems that implement fan speed control must be designed such that the processor remains within the system. Intel has developed a methodology for managing processor temperatures which is based on designing a component level thermal solution, refer to the appropriate Thermal and Mechanical Design Guidelines (see Section 5.2). Component...
Data Sheet
Page 72
... Considerations The case temperature is defined at 50 °C TC and typical voltage loadline. 2. 775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal requirements. 3. Analysis indicates that an application exceeds the TDP recommendation for the processor to thermal profile figure and associated table for sustained time periods. Intel recommends that the processor can dissipate. 4.
... Considerations The case temperature is defined at 50 °C TC and typical voltage loadline. 2. 775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal requirements. 3. Analysis indicates that an application exceeds the TDP recommendation for the processor to thermal profile figure and associated table for sustained time periods. Intel recommends that the processor can dissipate. 4.
Data Sheet
Page 76
... 18 illustrates where Intel recommends TC thermal measurements should be off and on temperature measurement methodology, refer to prevent rapid active/inactive transitions of the TCC when the processor temperature is active. The TCC reduces processor power consumption by ... the internal processor core clocks. The maximum and minimum case temperatures (TC) for the processor to help ensure proper operation of the package) 37.5 mm 5.2 5.2.1 37.5 mm Processor Thermal Features Thermal Monitor The Thermal Monitor feature helps control the processor temperature by activating...
... 18 illustrates where Intel recommends TC thermal measurements should be off and on temperature measurement methodology, refer to prevent rapid active/inactive transitions of the TCC when the processor temperature is active. The TCC reduces processor power consumption by ... the internal processor core clocks. The maximum and minimum case temperatures (TC) for the processor to help ensure proper operation of the package) 37.5 mm 5.2 5.2.1 37.5 mm Processor Thermal Features Thermal Monitor The Thermal Monitor feature helps control the processor temperature by activating...
Data Sheet
Page 77
... operating point consists of a specific operating frequency and voltage. When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the Thermal Control Circuit (TCC) will transition to the new core operating voltage by reducing the power consumption within the processor. Once the new operating frequency is factory configured and cannot be modified.
... operating point consists of a specific operating frequency and voltage. When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the Thermal Control Circuit (TCC) will transition to the new core operating voltage by reducing the power consumption within the processor. Once the new operating frequency is factory configured and cannot be modified.
Data Sheet
Page 78
... rely on software usage of the processor temperature. This mechanism is referred to limit the processor temperature. On-Demand Mode The processor provides an auxiliary mechanism that allows system software to force the processor to limit the processor temperature. On-Demand mode may be activated via modulation (starting and stopping) of the internal core clock, independent of this mechanism...
... rely on software usage of the processor temperature. This mechanism is referred to limit the processor temperature. On-Demand Mode The processor provides an auxiliary mechanism that allows system software to force the processor to limit the processor temperature. On-Demand mode may be activated via modulation (starting and stopping) of the internal core clock, independent of this mechanism...
Data Sheet
Page 79
... running the most power intensive applications. Thermal Specifications and Design Considerations 5.2.4 5.2.5 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has reached its maximum operating temperature or be driven from over-temperature situations. At this point, the FSB signal THERMTRIP# will remain active until the system de-asserts PROCHOT#. If...
... running the most power intensive applications. Thermal Specifications and Design Considerations 5.2.4 5.2.5 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has reached its maximum operating temperature or be driven from over-temperature situations. At this point, the FSB signal THERMTRIP# will remain active until the system de-asserts PROCHOT#. If...
Data Sheet
Page 80
.... Thermal Specifications and Design Considerations 5.3 Platform Environment Control Interface (PECI) 5.3.1 Introduction PECI offers an interface for thermal monitoring of Intel processor and chipset components. PECI uses CRC checking on PECI use the relative temperature value delivered over PECI represents the delta below the onset of zero. Thermal management devices should use a TCONTROL value...
.... Thermal Specifications and Design Considerations 5.3 Platform Environment Control Interface (PECI) 5.3.1 Introduction PECI offers an interface for thermal monitoring of Intel processor and chipset components. PECI uses CRC checking on PECI use the relative temperature value delivered over PECI represents the delta below the onset of zero. Thermal management devices should use a TCONTROL value...
Data Sheet
Page 81
...Fault Handling Requirements PECI is operational, but has detected a temperature below its operational range (underflow). § § Datasheet 81 System designs should take appropriate action to protect the client processor device if valid temperature readings have not been obtained in Table 30. The host... controller may also implement an alert to this document for the processor GetTemp0() and GetTemp1() commands are , however, ...
...Fault Handling Requirements PECI is operational, but has detected a temperature below its operational range (underflow). § § Datasheet 81 System designs should take appropriate action to protect the client processor device if valid temperature readings have not been obtained in Table 30. The host... controller may also implement an alert to this document for the processor GetTemp0() and GetTemp1() commands are , however, ...
Data Sheet
Page 92
... the fan heatsink is into the center and out of the sides of the system integrator. 92 Datasheet Boxed Processor Cooling Requirements The boxed processor may be kept below 39 ºC. However, meeting the processor's temperature specification is unimpeded. Figure 28 and Figure 29 illustrate an acceptable airspace clearance for the fan heatsink. Baseboard...
... the fan heatsink is into the center and out of the sides of the system integrator. 92 Datasheet Boxed Processor Cooling Requirements The boxed processor may be kept below 39 ºC. However, meeting the processor's temperature specification is unimpeded. Figure 28 and Figure 29 illustrate an acceptable airspace clearance for the fan heatsink. Baseboard...
Data Sheet
Page 94
... Thermal and Mechanical Design Guidelines (see Chapter 5) is connected to fan heatsink. The Internal chassis temperature should be kept below 38 ºC. Meeting the processor's temperature specification (see Section 1.2). Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is the responsibility of the system integrator. At that remains cooler...
... Thermal and Mechanical Design Guidelines (see Chapter 5) is connected to fan heatsink. The Internal chassis temperature should be kept below 38 ºC. Meeting the processor's temperature specification (see Section 1.2). Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is the responsibility of the system integrator. At that remains cooler...
Data Sheet
Page 95
... 30 When the internal chassis temperature is based on the motherboard that allows system integrators to the 4th pin of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system in the most common usage. Intel has added an option to... the boxed processor that sends out a PWM control signal to have generated increasingly more accurate measurement of internal ambient chassis temperatures. The fan speed is below or equal to this point,...
... 30 When the internal chassis temperature is based on the motherboard that allows system integrators to the 4th pin of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system in the most common usage. Intel has added an option to... the boxed processor that sends out a PWM control signal to have generated increasingly more accurate measurement of internal ambient chassis temperatures. The fan speed is below or equal to this point,...
Data Sheet
Page 96
... mode, allowing compatibility with existing 3-pin baseboard designs. For more details on the Tinlet temperature measured by a thermistor located at the fan inlet. Under thermistor controlled mode, the fan RPM is connected to an older 3-pin baseboard processor fan header it will default back to the appropriate Thermal and Mechanical Design Guidelines...
... mode, allowing compatibility with existing 3-pin baseboard designs. For more details on the Tinlet temperature measured by a thermistor located at the fan inlet. Under thermistor controlled mode, the fan RPM is connected to an older 3-pin baseboard processor fan header it will default back to the appropriate Thermal and Mechanical Design Guidelines...