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Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet -on 65 nm Process in the 775-land LGA Package supporting Intel® 64 architecture and Intel® Virtualization Technology± August 2007 Document Number: 315592-005
Intel® Core™2 Extreme Quad-Core Processor QX6000Δ Sequence and Intel® Core™2 Quad Processor Q6000Δ Sequence Datasheet -on 65 nm Process in the 775-land LGA Package supporting Intel® 64 architecture and Intel® Virtualization Technology± August 2007 Document Number: 315592-005
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... with your system vendor for more information including details on your application vendor. Intel reserves these for future definition and shall have no responsibility whatsoever for more information. The Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence may contain design defects or errors known as the property of any...
... with your system vendor for more information including details on your application vendor. Intel reserves these for future definition and shall have no responsibility whatsoever for more information. The Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence may contain design defects or errors known as the property of any...
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... 3.3 Package Loading Specifications 35 3.4 Package Handling Guidelines 35 3.5 Package Insertion Specifications 36 3.6 Processor Mass Specification 36 3.7 Processor Materials 36 3.8 Processor Markings 36 3.9 Processor Land Coordinates 38 4 Land Listing and Signal Descriptions 39 4.1 Processor Land Assignments 39 4.2 Alphabetical Signals Reference 62 5 Thermal Specifications and Design Considerations 71 5.1 Processor Thermal Specifications 71 5.1.1 Thermal Specifications 71 5.1.2 Thermal Metrology 76...
... 3.3 Package Loading Specifications 35 3.4 Package Handling Guidelines 35 3.5 Package Insertion Specifications 36 3.6 Processor Mass Specification 36 3.7 Processor Materials 36 3.8 Processor Markings 36 3.9 Processor Land Coordinates 38 4 Land Listing and Signal Descriptions 39 4.1 Processor Land Assignments 39 4.2 Alphabetical Signals Reference 62 5 Thermal Specifications and Design Considerations 71 5.1 Processor Thermal Specifications 71 5.1.1 Thermal Specifications 71 5.1.2 Thermal Metrology 76...
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... Attach Clip Assembly .....90 7.2 Electrical Requirements 90 7.2.1 Fan Heatsink Power Supply 90 7.3 Thermal Specifications 92 7.3.1 7.3.2 7.3.3 Boxed Processor Cooling Requirements 92 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) .........94 Fan Speed Control Operation (Intel® Core™2 Quad processor 94 8 Debug Tools Specifications 97 8.1 Logic Analyzer Interface (LAI 97 8.1.1 Mechanical Considerations 97 8.1.2 Electrical Considerations 97...
... Attach Clip Assembly .....90 7.2 Electrical Requirements 90 7.2.1 Fan Heatsink Power Supply 90 7.3 Thermal Specifications 92 7.3.1 7.3.2 7.3.3 Boxed Processor Cooling Requirements 92 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) .........94 Fan Speed Control Operation (Intel® Core™2 Quad processor 94 8 Debug Tools Specifications 97 8.1 Logic Analyzer Interface (LAI 97 8.1.1 Mechanical Considerations 97 8.1.2 Electrical Considerations 97...
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... Clock Crosspoint Specification 30 5 Differential Measurements 30 6 Processor Package Assembly Sketch 31 7 Processor Package Drawing Sheet 1 of 3 32 8 Processor Package Drawing Sheet 2 of 3 33 9 Processor Package Drawing Sheet 3 of the Boxed Processor 87 23 Space Requirements for the Boxed Processor (Side View 88 24 Space Requirements for the Boxed Processor (Top View 89 25 Space Requirements for...
... Clock Crosspoint Specification 30 5 Differential Measurements 30 6 Processor Package Assembly Sketch 31 7 Processor Package Drawing Sheet 1 of 3 32 8 Processor Package Drawing Sheet 2 of 3 33 9 Processor Package Drawing Sheet 3 of the Boxed Processor 87 23 Space Requirements for the Boxed Processor (Side View 88 24 Space Requirements for the Boxed Processor (Top View 89 25 Space Requirements for...
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...Specifications 24 12 CMOS Signal Group DC Specifications 25 13 PECI DC Electrical Limits 25 14 GTL+ Bus Voltage Definitions 26 15 Core Frequency to FSB Multiplier Configuration 26 16 BSEL[2:0] Frequency Table for BCLK[1:0 27 17 Front Side Bus Differential BCLK Specifications 28 ...Land Assignments 42 24 Numerical Land Assignment 52 25 Signal Description...62 26 Processor Thermal Specifications 72 27 Thermal Profile for 130 W Processors 73 28 Thermal Profile for 105 W Processors 74 29 Thermal Profile 95 W Processors 75 30 GetTemp0() and GetTemp1() Error Codes 81 31 Power-On ...
...Specifications 24 12 CMOS Signal Group DC Specifications 25 13 PECI DC Electrical Limits 25 14 GTL+ Bus Voltage Definitions 26 15 Core Frequency to FSB Multiplier Configuration 26 16 BSEL[2:0] Frequency Table for BCLK[1:0 27 17 Front Side Bus Differential BCLK Specifications 28 ...Land Assignments 42 24 Numerical Land Assignment 52 25 Signal Description...62 26 Processor Thermal Specifications 72 27 Thermal Profile for 130 W Processors 73 28 Thermal Profile for 105 W Processors 74 29 Thermal Profile 95 W Processors 75 30 GetTemp0() and GetTemp1() Error Codes 81 31 Power-On ...
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... 29, "Fan Heatsink Power and Signal Specifications". • Added specifications for the Intel® Core™2 Quad Processor Q6700 and Intel® Core™2 Extreme quad-core processor QX6850 • Added Intel® Core™2 Quad Processor Q6600 for 775_VR_CONFIG_05A • Added Intel® Core™2 Extreme quad-core processor QX6850 • Added Intel® Core™2 Extreme quad-core processor QX6800 § Date November 2006 January 2007 July 2007 July 2007 July 2007...
... 29, "Fan Heatsink Power and Signal Specifications". • Added specifications for the Intel® Core™2 Quad Processor Q6700 and Intel® Core™2 Extreme quad-core processor QX6850 • Added Intel® Core™2 Quad Processor Q6600 for 775_VR_CONFIG_05A • Added Intel® Core™2 Extreme quad-core processor QX6850 • Added Intel® Core™2 Extreme quad-core processor QX6800 § Date November 2006 January 2007 July 2007 July 2007 July 2007...
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Intel® Core™2 Extreme Quad-Core Processor QX6000 and Intel® Core™2 Quad Processor Q6000 Sequence Features • Available at 3.00 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6850 only) • Available at 2.66 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6700 and Intel® Core™2 Quad Processor Q6700 only) • Available at 2.40 GHz (Intel® Core™2 Quad Processor Q6600 only) • Available at 2.93 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6800...
Intel® Core™2 Extreme Quad-Core Processor QX6000 and Intel® Core™2 Quad Processor Q6000 Sequence Features • Available at 3.00 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6850 only) • Available at 2.66 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6700 and Intel® Core™2 Quad Processor Q6700 only) • Available at 2.40 GHz (Intel® Core™2 Quad Processor Q6600 only) • Available at 2.93 GHz (Intel® Core™2 Extreme Quad-Core Processor QX6800...
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In this document the Intel® Core™2 quad-core processor Q6000 sequence refers to the Intel® Core™2 quad processor Q6600 and Q6700. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2) and Streaming SIMD Extensions 3 (SSE3). The FSB uses Source-Synchronous Transfer (SST) of the infrastructure already enabled ...
In this document the Intel® Core™2 quad-core processor Q6000 sequence refers to the Intel® Core™2 quad processor Q6600 and Q6700. The processor supports all the existing Streaming SIMD Extensions 2 (SSE2) and Streaming SIMD Extensions 3 (SSE3). The FSB uses Source-Synchronous Transfer (SST) of the infrastructure already enabled ...
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... thus help improve the overall security of the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence. Component thermal solutions interface with a 2x4 MB L2 cache. • Intel® Core™2 quad processor Q6000 sequence - This feature can prevent some classes of the package. Quad core processor in the Intel Extended Memory 64 Technology Software Developer Guide...
... thus help improve the overall security of the Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel® Core™2 quad processor Q6000 sequence. Component thermal solutions interface with a 2x4 MB L2 cache. • Intel® Core™2 quad processor Q6000 sequence - This feature can prevent some classes of the package. Quad core processor in the Intel Extended Memory 64 Technology Software Developer Guide...
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... be made between performance and power consumptions, based on processor utilization. References Document Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket Balanced Technology...
... be made between performance and power consumptions, based on processor utilization. References Document Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad Processor Thermal and Mechanical Design Guidelines Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket Balanced Technology...
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... regulator solutions need to provide sufficient decoupling capacitance to do so can result in timing violations or reduced lifetime of the processor interfaces and signals. In addition, ceramic decoupling capacitors are required to ensure that meets the VTT specifications outlined in Table...within the specifications listed in Table 4. A separate supply must be supplied the voltage determined by the front side bus and processor activity. This includes bulk capacitance with the power delivery solution must be connected to the I/O buffers. Larger bulk storage (CBULK...
... regulator solutions need to provide sufficient decoupling capacitance to do so can result in timing violations or reduced lifetime of the processor interfaces and signals. In addition, ceramic decoupling capacitors are required to ensure that meets the VTT specifications outlined in Table...within the specifications listed in Table 4. A separate supply must be supplied the voltage determined by the front side bus and processor activity. This includes bulk capacitance with the power delivery solution must be connected to the I/O buffers. Larger bulk storage (CBULK...
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However, additional high frequency capacitance must be added to the motherboard to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for VCC overshoot specifications). Voltages for dynamic VID transitions are not used on the die. Refer to properly decouple the return ...
However, additional high frequency capacitance must be added to the motherboard to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for VCC overshoot specifications). Voltages for dynamic VID transitions are not used on the die. Refer to properly decouple the return ...
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...177; 20% of the impedance of the same value as the on -die termination. In a system level design, on the processor silicon. Unused outputs can be grouped with other ) can result in component malfunction or incompatibility with some TAP functions, complicate debug... noise margin, all RESERVED lands. Electrical Specifications 2.4 Reserved, Unused, and TESTHI Signals All RESERVED lands must be terminated within the processor silicon. Inputs and utilized outputs must remain unconnected. Unused outputs may use pull-up resistor which matches the nominal trace impedance. For...
...177; 20% of the impedance of the same value as the on -die termination. In a system level design, on the processor silicon. Unused outputs can be grouped with other ) can result in component malfunction or incompatibility with some TAP functions, complicate debug... noise margin, all RESERVED lands. Electrical Specifications 2.4 Reserved, Unused, and TESTHI Signals All RESERVED lands must be terminated within the processor silicon. Inputs and utilized outputs must remain unconnected. Unused outputs may use pull-up resistor which matches the nominal trace impedance. For...
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..., or its lifetime degraded depending on any tray or packaging. 5. Absolute Maximum and Minimum Ratings Symbol Parameter Min Max Unit Notes1,2 VCC Core voltage with respect to a voltage bias. TC Processor case temperature See Chapter 5 See Chapter 5 °C - Storage temperature is returned to conditions within functional operation limits after having been subjected...
..., or its lifetime degraded depending on any tray or packaging. 5. Absolute Maximum and Minimum Ratings Symbol Parameter Min Max Unit Notes1,2 VCC Core voltage with respect to a voltage bias. TC Processor case temperature See Chapter 5 See Chapter 5 °C - Storage temperature is returned to conditions within functional operation limits after having been subjected...
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... to Table 5 and Figure 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for a given current. Adherence to ensure reliable processor operation. 3. See Section 2.3 and Table 2 for VTT supply after VCC stable 8.0 - -... These voltages are calibrated during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep® Technology, or Extended HALT State). 4. The processor should be altered. ICC A 1.14 1.20 1.26 V 8 10 11, 12 VTT_OUT_LEFT and DC Current that ...
... to Table 5 and Figure 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for a given current. Adherence to ensure reliable processor operation. 3. See Section 2.3 and Table 2 for VTT supply after VCC stable 8.0 - -... These voltages are calibrated during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep® Technology, or Extended HALT State). 4. The processor should be altered. ICC A 1.14 1.20 1.26 V 8 10 11, 12 VTT_OUT_LEFT and DC Current that ...
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... provided via a separate voltage source and not be taken from VTT plane by only the processor. Voltage regulation feedback for the processor. 11.VTT must be connected to ensure reliable processor operation. This specification does not include the current coming from VID Setting (V)1, 2, 3, 4...184 -0.212 125 -0.163 -0.191 -0.219 NOTES: 1. Table 5. ICC_MAX specification is not tested. These Processors have CPUID = 06FBh 10.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the system. This table is ...
... provided via a separate voltage source and not be taken from VTT plane by only the processor. Voltage regulation feedback for the processor. 11.VTT must be connected to ensure reliable processor operation. This specification does not include the current coming from VID Setting (V)1, 2, 3, 4...184 -0.212 125 -0.163 -0.191 -0.219 NOTES: 1. Table 5. ICC_MAX specification is not tested. These Processors have CPUID = 06FBh 10.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the system. This table is ...
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...except for socket loadline guidelines and VR implementation details. 20 Datasheet Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for overshoot allowed as shown in Section 2.5.3. 2. Voltage regulation feedback for... voltage regulator circuits must be taken from the VID set point. 3. This loadline specification shows the deviation from processor VCC and VSS lands. VCC Static and Transient Tolerance 0 VID - 0.000 VID - 0.013 VID - 0.025 VID - 0.038 VID - ...
...except for socket loadline guidelines and VR implementation details. 20 Datasheet Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for overshoot allowed as shown in Section 2.5.3. 2. Voltage regulation feedback for... voltage regulator circuits must be taken from the VID set point. 3. This loadline specification shows the deviation from processor VCC and VSS lands. VCC Static and Transient Tolerance 0 VID - 0.000 VID - 0.013 VID - 0.025 VID - 0.038 VID - ...
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...a greater than or equal to 100 MHz bandwidth limit. VOS is the maximum allowable overshoot voltage). VCC Overshoot The processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to ensure reliable... processor operation. Adherence to the processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands. Datasheet 21 These specifications apply to these specifications is measured ...
...a greater than or equal to 100 MHz bandwidth limit. VOS is the maximum allowable overshoot voltage). VCC Overshoot The processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to ensure reliable... processor operation. Adherence to the processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands. Datasheet 21 These specifications apply to these specifications is measured ...
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... when receiving. This technology provides improved noise margins and reduced ringing through low voltage swings and controlled edge rates. Intel chipsets will also provide on the motherboard for common clock signals which are dependent upon the rising edge of BCLK0....differential input buffers, which signals are still present (A20M#, IGNNE#, etc.) and can become even more critical than with previous processor families. With the implementation of timing parameters. Table 7 identifies which use Gunning Transceiver Logic (GTL+) signaling technology. Electrical Specifications ...
... when receiving. This technology provides improved noise margins and reduced ringing through low voltage swings and controlled edge rates. Intel chipsets will also provide on the motherboard for common clock signals which are dependent upon the rising edge of BCLK0....differential input buffers, which signals are still present (A20M#, IGNNE#, etc.) and can become even more critical than with previous processor families. With the implementation of timing parameters. Table 7 identifies which use Gunning Transceiver Logic (GTL+) signaling technology. Electrical Specifications ...