Data Sheet
Page 4
... Mechanism and Heatsink Attach Clip Assembly .....90 7.2 Electrical Requirements 90 7.2.1 Fan Heatsink Power Supply 90 7.3 Thermal Specifications 92 7.3.1 7.3.2 7.3.3 Boxed Processor Cooling Requirements 92 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) .........94 Fan Speed Control Operation (Intel® Core™2 Quad processor 94 8 Debug Tools Specifications 97 8.1 Logic Analyzer Interface (LAI 97 8.1.1 Mechanical Considerations 97 8.1.2 Electrical Considerations...
... Mechanism and Heatsink Attach Clip Assembly .....90 7.2 Electrical Requirements 90 7.2.1 Fan Heatsink Power Supply 90 7.3 Thermal Specifications 92 7.3.1 7.3.2 7.3.3 Boxed Processor Cooling Requirements 92 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) .........94 Fan Speed Control Operation (Intel® Core™2 Quad processor 94 8 Debug Tools Specifications 97 8.1 Logic Analyzer Interface (LAI 97 8.1.1 Mechanical Considerations 97 8.1.2 Electrical Considerations...
Data Sheet
Page 13
... capable of transistors and high internal clock speeds, the processor is not adequate. Larger bulk storage (CBULK), such as a storage well for the front side bus and power to keep the voltage rail within the specifications listed in Table 4. All power lands must be supplied the voltage determined by the component, such as VTT...
... capable of transistors and high internal clock speeds, the processor is not adequate. Larger bulk storage (CBULK), such as a storage well for the front side bus and power to keep the voltage rail within the specifications listed in Table 4. All power lands must be supplied the voltage determined by the component, such as VTT...
Data Sheet
Page 14
... valid core frequency and VID values of power supply voltages. The voltage set by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Refer to the processor VCC pins (see Chapter 2.5.3 for compatibility with future processors. Refer... reference VR output voltage to be connected to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for these signals. Voltages for the processor is provided in this differs from the front side ...
... valid core frequency and VID values of power supply voltages. The voltage set by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. Refer to the processor VCC pins (see Chapter 2.5.3 for compatibility with future processors. Refer... reference VR output voltage to be connected to the Intel® Core™2 Extreme Quad-Core Processor QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for these signals. Voltages for the processor is provided in this differs from the front side ...
Data Sheet
Page 18
...oscilloscope probe. 6. The voltage specification requirements are calibrated during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep® Technology, or Extended HALT State). 4. V PLL VCC - 5% 1.50 + 5% Processor Number ICC for 775_VR_CONFIG_05B QX6850 QX6800 3.00 GHz 2.93 GHz...processor operation. 3. Ensure external noise from VTT_OUT_RIGHT VTT_OUT_LEFT and VTT_OUT_RIGHT per pin - These voltages are required to Table 5 and Figure 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for VTT supply...
...oscilloscope probe. 6. The voltage specification requirements are calibrated during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep® Technology, or Extended HALT State). 4. V PLL VCC - 5% 1.50 + 5% Processor Number ICC for 775_VR_CONFIG_05B QX6850 QX6800 3.00 GHz 2.93 GHz...processor operation. 3. Ensure external noise from VTT_OUT_RIGHT VTT_OUT_LEFT and VTT_OUT_RIGHT per pin - These voltages are required to Table 5 and Figure 1 V 4, 5, 6 QX6700 2.66 GHz Q6700 2.66 GHz Q6600 2.40 GHz VCC_BOOT VCCPLL ICC Default VCC voltage for VTT supply...
Data Sheet
Page 22
...through low voltage swings and controlled edge rates. Intel chipsets will also provide on the motherboard for GTL+ signals defined as processor frequency increases. With the implementation of a ...Output" refers to determine if a signal is used by buffer type. Because platforms implement separate power planes for the source synchronous signals which use Gunning Transceiver Logic (GTL+) signaling technology. Termination... when driving. One set is for each processor (and chipset), separate VCC and VTT supplies are terminated to the GTL+ input group as well as the GTL+ ...
...through low voltage swings and controlled edge rates. Intel chipsets will also provide on the motherboard for GTL+ signals defined as processor frequency increases. With the implementation of a ...Output" refers to determine if a signal is used by buffer type. Because platforms implement separate power planes for the source synchronous signals which use Gunning Transceiver Logic (GTL+) signaling technology. Termination... when driving. One set is for each processor (and chipset), separate VCC and VTT supplies are terminated to the GTL+ input group as well as the GTL+ ...
Data Sheet
Page 25
...;A 2 10 µA 2 10 pF - Leakage to VSS with land held at 300 mV Table 13. VTT supplies the PECI interface. PECI behavior does not affect VTT min/max specifications. The leakage specification applies to all processor frequencies. 2. Electrical Specifications Table 12. IOH is defined as the voltage range at a receiving agent that... that will be interpreted as a logical low value. 3. Datasheet 25 VIH is measured at 0.90 * VTT. 8. The VTT referred to in this table apply to powered devices on the PECI bus. 3. All outputs are open drain. 7.
...;A 2 10 µA 2 10 pF - Leakage to VSS with land held at 300 mV Table 13. VTT supplies the PECI interface. PECI behavior does not affect VTT min/max specifications. The leakage specification applies to all processor frequencies. 2. Electrical Specifications Table 12. IOH is defined as the voltage range at a receiving agent that... that will be interpreted as a logical low value. 3. Datasheet 25 VIH is measured at 0.90 * VTT. 8. The VTT referred to in this table apply to powered devices on the PECI bus. 3. All outputs are open drain. 7.
Data Sheet
Page 67
... scan operation. Land Listing and Signal Descriptions Table 25. The TCC will deassert their proper specifications. The processor requires this signal to a high state. The signal must not be a clean indication that the clocks and power supplies are turned on -die termination and must connect the appropriate pins/ lands of their specifications. 'Clean...
... scan operation. Land Listing and Signal Descriptions Table 25. The TCC will deassert their proper specifications. The processor requires this signal to a high state. The signal must not be a clean indication that the clocks and power supplies are turned on -die termination and must connect the appropriate pins/ lands of their specifications. 'Clean...
Data Sheet
Page 69
... by the VR to processor Output core power (VCC). Assertion of THERMTRIP#, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be removed following the assertion of power supply voltages (VCC). The ...assertion of a catastrophic cooling failure, the processor will shut off its core voltage (VCC) must be valid before the VR can be driven low during power on the processor package and is ready to these signals. The voltage supplied to receive a write or implicit writeback ...
... by the VR to processor Output core power (VCC). Assertion of THERMTRIP#, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the trip level, THERMTRIP# will again be removed following the assertion of power supply voltages (VCC). The ...assertion of a catastrophic cooling failure, the processor will shut off its core voltage (VCC) must be valid before the VR can be driven low during power on the processor package and is ready to these signals. The voltage supplied to receive a write or implicit writeback ...
Data Sheet
Page 70
... in the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. It is connected internally in the package to VSS. Miscellaneous voltage supply. This land is connected internally in the processor package to the sense point land V27 as described.... VSSA is connected to VTT. § § 70 Datasheet VSS are included to provide a voltage supply for the processor and should be used to processor core VSS. The VTT_SEL signal is an isolated low impedance connection to select the correct VTT voltage level for internal...
... in the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. It is connected internally in the package to VSS. Miscellaneous voltage supply. This land is connected internally in the processor package to the sense point land V27 as described.... VSSA is connected to VTT. § § 70 Datasheet VSS are included to provide a voltage supply for the processor and should be used to processor core VSS. The VTT_SEL signal is an isolated low impedance connection to select the correct VTT voltage level for internal...
Data Sheet
Page 90
... should be shipped with the heatsink attach clip assembly. The boxed processor will ship with the boxed processor to draw power from the center of the fan power connector relative to the processor socket. Electrical Requirements Fan Heatsink Power Supply The boxed processor's fan heatsink requires a +12 V power supply. Table 32 contains specifications for details on the baseboard. Use of...
... should be shipped with the heatsink attach clip assembly. The boxed processor will ship with the boxed processor to draw power from the center of the fan power connector relative to the processor socket. Electrical Requirements Fan Heatsink Power Supply The boxed processor's fan heatsink requires a +12 V power supply. Table 32 contains specifications for details on the baseboard. Use of...
Data Sheet
Page 91
...Unit V Notes - Boxed Processor Fan Heatsink Power Cable Connector Description Pin Signal 1 GND 2 +12 V 3 SENSE 4 CONTROL Straight square pin, 4-pin terminal housing with straight pin, friction lock header on mainboard. 1 2 34 Table 32. Boxed Processor Specifications Figure 26. Baseboard should...fan steady-state current draw - 0.5 - Maximum fan start -up current draw - 2.2 - Fan Heatsink Power and Signal Specifications Description Min Typ +12 V: 12 volt fan power supply 11.4 12 IC: - Maximum fan steady-state current draw - 1.2 - Fan start -up current draw ...
...Unit V Notes - Boxed Processor Fan Heatsink Power Cable Connector Description Pin Signal 1 GND 2 +12 V 3 SENSE 4 CONTROL Straight square pin, 4-pin terminal housing with straight pin, friction lock header on mainboard. 1 2 34 Table 32. Boxed Processor Specifications Figure 26. Baseboard should...fan steady-state current draw - 0.5 - Maximum fan start -up current draw - 2.2 - Fan Heatsink Power and Signal Specifications Description Min Typ +12 V: 12 volt fan power supply 11.4 12 IC: - Maximum fan steady-state current draw - 1.2 - Fan start -up current draw ...
Data Sheet
Page 94
... of the system integrator. The motherboard must supply a constant +12 V to the processor's power header to allow maximum user control over a short range of internal chassis temperatures. This is the responsibility of the fan for the boxed processor. Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is connected to...
... of the system integrator. The motherboard must supply a constant +12 V to the processor's power header to allow maximum user control over a short range of internal chassis temperatures. This is the responsibility of the fan for the boxed processor. Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is connected to...