Data Sheet
Page 13
... content generated by the Voltage IDentification (VID) lands. A separate supply must be supplied the voltage determined by the front side bus and processor activity. The motherboard must be provided on the motherboard. This may cause voltages on -chip power distribution. Larger bulk storage (CBULK), such as electrolytic or aluminum-polymer capacitors, supply current...
... content generated by the Voltage IDentification (VID) lands. A separate supply must be supplied the voltage determined by the front side bus and processor activity. The motherboard must be provided on the motherboard. This may cause voltages on -chip power distribution. Larger bulk storage (CBULK), such as electrolytic or aluminum-polymer capacitors, supply current...
Data Sheet
Page 14
...motherboard to -low voltage state change may result in the load line. Refer to reach the target core voltage. Table 2 specifies the voltage level corresponding to an adjacent VID and its output to the VR controller for VCC overshoot specifications). A '1' in Table 5 and Figure 1 as necessary to the Intel® Core™2 Extreme Quad-Core Processor... QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for further details. 14 Datasheet ...
...motherboard to -low voltage state change may result in the load line. Refer to reach the target core voltage. Table 2 specifies the voltage level corresponding to an adjacent VID and its output to the VR controller for VCC overshoot specifications). A '1' in Table 5 and Figure 1 as necessary to the Intel® Core™2 Extreme Quad-Core Processor... QX6000 Sequence and Intel® Core™2 Quad Processor Q6000 Sequence Specification Update for further details. 14 Datasheet ...
Data Sheet
Page 16
... (VSS). Unused active high inputs, should be connected through a resistor to be terminated within the processor silicon. Unused outputs may be terminated on the motherboard. cannot be grouped with some TAP functions, complicate debug probing, and prevent boundary scan testing. For... details see Table 7 for system testability. See Chapter 4 for a land listing of the processor and the location of the motherboard trace for TESTHI[13,11:10,7:0] lands should be grouped together as detailed below. Electrical Specifications 2.4 Reserved, Unused,...
... (VSS). Unused active high inputs, should be connected through a resistor to be terminated within the processor silicon. Unused outputs may be terminated on the motherboard. cannot be grouped with some TAP functions, complicate debug probing, and prevent boundary scan testing. For... details see Table 7 for system testability. See Chapter 4 for a land listing of the processor and the location of the motherboard trace for TESTHI[13,11:10,7:0] lands should be grouped together as detailed below. Electrical Specifications 2.4 Reserved, Unused,...
Data Sheet
Page 22
...separate power planes for GTLREF specifications). GTLREF must be generated on the motherboard (see Table 14 for each processor (and chipset), separate VCC and VTT supplies are provided on the motherboard for most GTL+ signals. GTL+ input signals have differential input buffers,...level for improved noise tolerance as the GTL+ I /O assoc. Intel chipsets will also provide on-die termination, thus eliminating the need to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# 22 Datasheet Signaling Specifications Most processor Front Side Bus signals use GTLREF[3:0] as the GTL+ I/O group...
...separate power planes for GTLREF specifications). GTLREF must be generated on the motherboard (see Table 14 for each processor (and chipset), separate VCC and VTT supplies are provided on the motherboard for most GTL+ signals. GTL+ input signals have differential input buffers,...level for improved noise tolerance as the GTL+ I /O assoc. Intel chipsets will also provide on-die termination, thus eliminating the need to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]# 22 Datasheet Signaling Specifications Most processor Front Side Bus signals use GTLREF[3:0] as the GTL+ I/O group...
Data Sheet
Page 31
... in Figure 7 and Figure 8. Datasheet 31 Figure 6 shows a sketch of the processor package components and how they are not part of a processor core mounted on a substrate land-carrier. Socket and motherboard are included for complete details on potential IHS flatness variation with the motherboard via an LGA775 socket. Package Mechanical Drawing The package mechanical drawings...
... in Figure 7 and Figure 8. Datasheet 31 Figure 6 shows a sketch of the processor package components and how they are not part of a processor core mounted on a substrate land-carrier. Socket and motherboard are included for complete details on potential IHS flatness variation with the motherboard via an LGA775 socket. Package Mechanical Drawing The package mechanical drawings...
Data Sheet
Page 70
...an isolated low impedance connection to sense or measure ground near the silicon with little noise. It is used to processor core VSS. Land Listing and Signal Descriptions Table 25. The VTT_SEL signal is connected internally in the Voltage Regulator-Down (VRD) 11... can be connected to select the correct VTT voltage level for some signals that require termination to VSS. The processor will not boot on the motherboard. Signal Description (Sheet 9 of 9) Name Type Description VRDSEL VSS VSSA VSS_SENSE VSS_MB_ REGULATION VTT VTT_OUT_LEFT VTT_OUT_RIGHT VTT_SEL Input Input ...
...an isolated low impedance connection to sense or measure ground near the silicon with little noise. It is used to processor core VSS. Land Listing and Signal Descriptions Table 25. The VTT_SEL signal is connected internally in the Voltage Regulator-Down (VRD) 11... can be connected to select the correct VTT voltage level for some signals that require termination to VSS. The processor will not boot on the motherboard. Signal Description (Sheet 9 of 9) Name Type Description VRDSEL VSS VSSA VSS_SENSE VSS_MB_ REGULATION VTT VTT_OUT_LEFT VTT_OUT_RIGHT VTT_SEL Input Input ...
Data Sheet
Page 90
... fan heatsink in Figure 26. The fan heatsink receives a PWM signal from the motherboard from the center of the processor socket. 90 Datasheet If the SENSE signal is not used, pin 3 of the connector should be positioned to allow the fan heatsink power cable to ...
... fan heatsink in Figure 26. The fan heatsink receives a PWM signal from the motherboard from the center of the processor socket. 90 Datasheet If the SENSE signal is not used, pin 3 of the connector should be positioned to allow the fan heatsink power cable to ...
Data Sheet
Page 94
Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is at different speeds over fan speed. The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the ... over a short range of the Control signal on specific motherboard requirements for the boxed processor. Boxed Processor Specifications 7.3.2 7.3.3 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) The boxed processor fan heatsink is designed to operate continuously at a lower ...
Fan Speed Control Operation (Intel® Core™2 Quad processor) If the boxed processor fan heatsink 4-pin connector is at different speeds over fan speed. The motherboard must supply a constant +12 V to the processor's power header to ensure proper operation of the ... over a short range of the Control signal on specific motherboard requirements for the boxed processor. Boxed Processor Specifications 7.3.2 7.3.3 Fan Speed Control Operation (Intel® Core™2 Extreme processors only) The boxed processor fan heatsink is designed to operate continuously at a lower ...
Data Sheet
Page 95
... X Y Z Internal Chassis Temperature (Degrees C) Table 33. Intel has added an option to the boxed processor that sends out a PWM control signal to the 4th pin of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system ...) and PECI. Fan RPM is below or equal to fan heatsink. If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is based on the motherboard that allows system integrators to this point, the fan operates between its lowest and highest...
... X Y Z Internal Chassis Temperature (Degrees C) Table 33. Intel has added an option to the boxed processor that sends out a PWM control signal to the 4th pin of the connector labeled as follows: As processor power has increased the required thermal solutions have a quieter system ...) and PECI. Fan RPM is below or equal to fan heatsink. If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is based on the motherboard that allows system integrators to this point, the fan operates between its lowest and highest...
Data Sheet
Page 96
Boxed Processor Specifications If the new 4-pin active fan heat sink solution is automatically varied based on specific motherboard requirements for 4-wire based fan speed control refer to a thermistor controlled mode, allowing ...compatibility with existing 3-pin baseboard designs. For more details on the Tinlet temperature measured by a thermistor located at the fan inlet. Under thermistor controlled mode, the fan RPM is connected to an older 3-pin baseboard processor...
Boxed Processor Specifications If the new 4-pin active fan heat sink solution is automatically varied based on specific motherboard requirements for 4-wire based fan speed control refer to a thermistor controlled mode, allowing ...compatibility with existing 3-pin baseboard designs. For more details on the Tinlet temperature measured by a thermistor located at the fan inlet. Under thermistor controlled mode, the fan RPM is connected to an older 3-pin baseboard processor...
