Mechanical Design Guidelines
Page 7
... Bead 97 Figure 7-30. Application of Intel® Boxed Processor Thermal Solutions.22 Table 5-1. Removing Excess Adhesive from IHS 101 Figure 7-36. BTX Thermal Module Keep Out Volumetric - Sheet 4 116 Figure 7-47. Sheet 2 121 Figure 7-52. Heatsink Inlet Temperature of Accelerant 100 Figure 7-35. Processor Preload Limits 49 Table 6-1. Figure 7-27. Removing Excess Solder...
... Bead 97 Figure 7-30. Application of Intel® Boxed Processor Thermal Solutions.22 Table 5-1. Removing Excess Adhesive from IHS 101 Figure 7-36. BTX Thermal Module Keep Out Volumetric - Sheet 4 116 Figure 7-47. Sheet 2 121 Figure 7-52. Heatsink Inlet Temperature of Accelerant 100 Figure 7-35. Processor Preload Limits 49 Table 6-1. Figure 7-27. Removing Excess Solder...