Service Manual
Page 72
... a BARE IC , so we can set IC on PCB directly, a soldering defect rate decrease. * composition 1) FPC + Heat /Sink ⇒ FPC for COF must have a Low Spec decline with LOW COST because we do not solder IC on it in B/D. the more the resolution higher, the less spare space where can get... IC with getting damp 2) CHIP resistor + CHIP CAPACITOR 3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE 4) EPOXY MOLDING * 42 V6 COF is controlled by COF when be on or off. 96 output pin per IC. Bare IC COF (Chip On Film) : supply a waveform which...
... a BARE IC , so we can set IC on PCB directly, a soldering defect rate decrease. * composition 1) FPC + Heat /Sink ⇒ FPC for COF must have a Low Spec decline with LOW COST because we do not solder IC on it in B/D. the more the resolution higher, the less spare space where can get... IC with getting damp 2) CHIP resistor + CHIP CAPACITOR 3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE 4) EPOXY MOLDING * 42 V6 COF is controlled by COF when be on or off. 96 output pin per IC. Bare IC COF (Chip On Film) : supply a waveform which...