Data Sheet
Page 19
... power specifications in Table 48 on page 55. Revision History xix Added 475 MHz specifications to mem32 for PUNPCKLBW, PUNPCKLWD, and PUNPCKLDQ on page 290. ...the example on page 81. Added definition of Boundary Scan Register (BSR) for OPN Suffixes AGR, AFX, and 400AFR". Changed mem64 to Table 54, "DC Characteristics for OPN Suffixes AHX, 400AFQ, ...bit descriptions. Updated Chapter 21, "Ordering Information". Added 500 MHz specifications. 21850J/0-February 2000 Preliminary Information AMD-K6®-2 Processor Data Sheet Revision History Date Feb 1999 Feb 1999 Feb 1999...
... power specifications in Table 48 on page 55. Revision History xix Added 475 MHz specifications to mem32 for PUNPCKLBW, PUNPCKLWD, and PUNPCKLDQ on page 290. ...the example on page 81. Added definition of Boundary Scan Register (BSR) for OPN Suffixes AGR, AFX, and 400AFR". Changed mem64 to Table 54, "DC Characteristics for OPN Suffixes AHX, 400AFQ, ...bit descriptions. Updated Chapter 21, "Ordering Information". Added 500 MHz specifications. 21850J/0-February 2000 Preliminary Information AMD-K6®-2 Processor Data Sheet Revision History Date Feb 1999 Feb 1999 Feb 1999...
Data Sheet
Page 280
...OPN Suffixes AGR, AFX, and 400AFR (continued) Symbol Parameter Description Preliminary Data Min Max Comments 10.00 A 400 MHz, Note 2, 8, 10 11.25 A 450 MHz, Note 2, 10 2.2 V Power Supply Current ICC2 11.90 A 12.50 A 475 MHz, Note 2, 9 500 MHz, Note 2, 10 533 MHz, Note 2, 11...: 1. This specification applies to components using a CLK frequency of 95 MHz. 10. VCC2 = 2.3 V - This specification applies to components using a CLK frequency of 100 MHz. 11. AMD-K6®-2 Processor Data Sheet Preliminary Information 21850J/0-February 2000 Table 58. This specification applies ...
...OPN Suffixes AGR, AFX, and 400AFR (continued) Symbol Parameter Description Preliminary Data Min Max Comments 10.00 A 400 MHz, Note 2, 8, 10 11.25 A 450 MHz, Note 2, 10 2.2 V Power Supply Current ICC2 11.90 A 12.50 A 475 MHz, Note 2, 9 500 MHz, Note 2, 10 533 MHz, Note 2, 11...: 1. This specification applies to components using a CLK frequency of 95 MHz. 10. VCC2 = 2.3 V - This specification applies to components using a CLK frequency of 100 MHz. 11. AMD-K6®-2 Processor Data Sheet Preliminary Information 21850J/0-February 2000 Table 58. This specification applies ...
Data Sheet
Page 282
...clock control state must be taken into account when designing a solution for thermal dissipation for OPN Suffixes AGR, AFX, and 400AFR Clock Control State 400 450 MHz6,8 MHz8 475 MHz7 500 533 550 MHz8 MHz9,10 MHz8 Notes Thermal Power (Maximum) 16.90 W 18.80 W... the internal PLL are identical to components using a CLK frequency of the AMD-K6-2 processor during normal and reduced power states. This specification applies to the specifications of 97 MHz. 10. AMD-K6®-2 Processor Data Sheet Preliminary Information 21850J/0-February 2000 Power Dissipation Table 59 contains the ...
...clock control state must be taken into account when designing a solution for thermal dissipation for OPN Suffixes AGR, AFX, and 400AFR Clock Control State 400 450 MHz6,8 MHz8 475 MHz7 500 533 550 MHz8 MHz9,10 MHz8 Notes Thermal Power (Maximum) 16.90 W 18.80 W... the internal PLL are identical to components using a CLK frequency of the AMD-K6-2 processor during normal and reduced power states. This specification applies to the specifications of 97 MHz. 10. AMD-K6®-2 Processor Data Sheet Preliminary Information 21850J/0-February 2000 Power Dissipation Table 59 contains the ...
Data Sheet
Page 307
...AMD-K6®-2 Processor Data Sheet Table 72. Package Thermal Specification for the 533 MHz component are applicable to the specifications of a processor w it h a p a s sive t h e rm a l so l u t i on page 288 shows the thermal model of the 500 MHz component. The specifications provided for OPN Suffixes AGR, AFX..., and 400AFR θJC Junction-Case 1.0 °C/W Maximum Thermal Power 2.2 V Component 2.3 V Component 400 MHz1 450 MHz 475 MHz 500 MHz 533 MHz2 16.90 W 18.80 W 19.80 W 20.75 W 550 MHz 25....
...AMD-K6®-2 Processor Data Sheet Table 72. Package Thermal Specification for the 533 MHz component are applicable to the specifications of a processor w it h a p a s sive t h e rm a l so l u t i on page 288 shows the thermal model of the 500 MHz component. The specifications provided for OPN Suffixes AGR, AFX..., and 400AFR θJC Junction-Case 1.0 °C/W Maximum Thermal Power 2.2 V Component 2.3 V Component 400 MHz1 450 MHz 475 MHz 500 MHz 533 MHz2 16.90 W 18.80 W 19.80 W 20.75 W 550 MHz 25....