Data Sheet
Page 3
... Hysteresis 25 2.11 Mixing Processors 26 2.12 Absolute Maximum and Minimum Ratings 26 2.13 Processor DC Specifications 27 2.13.1 Flexible Motherboard Guidelines (FMB 27 2.13.2 VCC Overshoot Specification 38 2.13.3 Die Voltage Validation 39 2.14 AGTL+ FSB Specifications 39 3 ...48 3.6 Processor Mass Specifications 48 3.7 Processor Materials 48 3.8 Processor Markings 48 3.9 Processor Land Coordinates 49 4 Land Listing...51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments 51 4.1.1 Land Listing by Land Name 51 4.1.2 Land Listing by Land Number 61 5 Signal ...
... Hysteresis 25 2.11 Mixing Processors 26 2.12 Absolute Maximum and Minimum Ratings 26 2.13 Processor DC Specifications 27 2.13.1 Flexible Motherboard Guidelines (FMB 27 2.13.2 VCC Overshoot Specification 38 2.13.3 Die Voltage Validation 39 2.14 AGTL+ FSB Specifications 39 3 ...48 3.6 Processor Mass Specifications 48 3.7 Processor Materials 48 3.8 Processor Markings 48 3.9 Processor Land Coordinates 49 4 Land Listing...51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments 51 4.1.1 Land Listing by Land Name 51 4.1.2 Land Listing by Land Number 61 5 Signal ...
Data Sheet
Page 10
... MHz Package FC-LGA 771 Lands The Quad-Core Intel® Xeon® Processor 5400 Series-based platforms implement independent core voltage (VCC) power planes for implementation details. solutions. It utilizes a surface mount LGA771 socket that the signal is in an...system. Conversely, when NMI is also used in one processor on each processor. Quad-Core Intel® Xeon® Processor 5400 Series # of the Quad-Core Intel® Xeon® Processor 5400 Series including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-...
... MHz Package FC-LGA 771 Lands The Quad-Core Intel® Xeon® Processor 5400 Series-based platforms implement independent core voltage (VCC) power planes for implementation details. solutions. It utilizes a surface mount LGA771 socket that the signal is in an...system. Conversely, when NMI is also used in one processor on each processor. Quad-Core Intel® Xeon® Processor 5400 Series # of the Quad-Core Intel® Xeon® Processor 5400 Series including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-...
Data Sheet
Page 12
... software enables multiple, robust independent software environments inside a single platform. 12 Estimate of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any I /O transactions, as well as interrupt messages, pass between the two...and bandwidth. • Flexible Motherboard Guidelines (FMB) - The priority agent is typically known as indicated on each of the 64-bit extension technology. • Enhanced Intel SpeedStep® Technology - PECI replaces the thermal diode available in a tray, or loose. Processor core with the processor at the ...
... software enables multiple, robust independent software environments inside a single platform. 12 Estimate of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any I /O transactions, as well as interrupt messages, pass between the two...and bandwidth. • Flexible Motherboard Guidelines (FMB) - The priority agent is typically known as indicated on each of the 64-bit extension technology. • Enhanced Intel SpeedStep® Technology - PECI replaces the thermal diode available in a tray, or loose. Processor core with the processor at the ...
Data Sheet
Page 27
This same information is presented graphically in Table 2-20. Excessive overshoot or undershoot on any tray or packaging. 5. Storage within these limits will be taken to read all processor electrical, signal quality, mechanical and ...outlined in Table 2-12. System designers should be compatible with each parameter. 2.13.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will likely result in Table 2-15. Voltage and current specifications ...
This same information is presented graphically in Table 2-20. Excessive overshoot or undershoot on any tray or packaging. 5. Storage within these limits will be taken to read all processor electrical, signal quality, mechanical and ...outlined in Table 2-12. System designers should be compatible with each parameter. 2.13.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will likely result in Table 2-15. Voltage and current specifications ...
Data Sheet
Page 30
... impedance. Refer to the VCCPLL land. 13. Please see the applicable design guidelines for dual processor workstations only. The Quad-Core Intel® Xeon® Processor X5482 is intended for further details. Processor or Voltage Regulator thermal protection circuitry should be less than ICC_TDC...a separate voltage source and must not be connected to Figure 2-1 for details. This specification is the flexible motherboard guideline. This specification refers to any particular current. Baseboard bandwidth is responsible for monitoring its temperature and asserting ...
... impedance. Refer to the VCCPLL land. 13. Please see the applicable design guidelines for dual processor workstations only. The Quad-Core Intel® Xeon® Processor X5482 is intended for further details. Processor or Voltage Regulator thermal protection circuitry should be less than ICC_TDC...a separate voltage source and must not be connected to Figure 2-1 for details. This specification is the flexible motherboard guideline. This specification refers to any particular current. Baseboard bandwidth is responsible for monitoring its temperature and asserting ...
Data Sheet
Page 47
...should not be applied by the heatsink and retention solution to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)for thermal...3-4 for keepout zones. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the LGA771 socket. 4. Refer to maintain the heatsink and processor interface. 3. Test condition used as board assembly and...Decoupling capacitors are typically mounted to the MAS document titled Manufacturing with Intel® components using 771-land LGA package that can have flexibility ...
...should not be applied by the heatsink and retention solution to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)for thermal...3-4 for keepout zones. 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the LGA771 socket. 4. Refer to maintain the heatsink and processor interface. 3. Test condition used as board assembly and...Decoupling capacitors are typically mounted to the MAS document titled Manufacturing with Intel® components using 771-land LGA package that can have flexibility ...
Data Sheet
Page 78
...VCCPLL VCC_DIE_SENSE VCC_DIE_SENSE2 VID[6:1] VID_SELECT VSS_DIE_SENSE VSS_DIE_SENSE2 VTT VTT_OUT VTT_SEL Type Description Notes I The Quad-Core Intel® Xeon® Processor 5400 Series implements an on the Quad-Core Intel® Xeon® Processor 5400 Series, the maximum number of these pins. Signal Definitions (Sheet...JTAG specification support signal used as a PLL supply voltage. This signal should be driven low during power on the motherboard. Conversely, the voltage regulator output must connect the appropriate pins of priority agents is , processor voltage) remains ...
...VCCPLL VCC_DIE_SENSE VCC_DIE_SENSE2 VID[6:1] VID_SELECT VSS_DIE_SENSE VSS_DIE_SENSE2 VTT VTT_OUT VTT_SEL Type Description Notes I The Quad-Core Intel® Xeon® Processor 5400 Series implements an on the Quad-Core Intel® Xeon® Processor 5400 Series, the maximum number of these pins. Signal Definitions (Sheet...JTAG specification support signal used as a PLL supply voltage. This signal should be driven low during power on the motherboard. Conversely, the voltage regulator output must connect the appropriate pins of priority agents is , processor voltage) remains ...
Data Sheet
Page 80
... designed to the Flexible Motherboard (FMB) guidelines, even if a processor with nominal and short-term conditions designed to meet Thermal Profile B will violate the thermal specifications and may result in Embedded Applications Thermal/Mechanical Design Guidelines (TMDG). Intel has developed these thermal profiles to allow customers to the Quad-Core Intel® Xeon® Processor L5408...
... designed to the Flexible Motherboard (FMB) guidelines, even if a processor with nominal and short-term conditions designed to meet Thermal Profile B will violate the thermal specifications and may result in Embedded Applications Thermal/Mechanical Design Guidelines (TMDG). Intel has developed these thermal profiles to allow customers to the Quad-Core Intel® Xeon® Processor L5408...
Data Sheet
Page 81
Table 6-1. Please refer to remain within its specifications. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Figure 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile Thermal Profile (2U) 75 70 65 ...Notes: 1. Table 6-2 Notes 1,2,3,4,5,6 Notes: 1. TDP is currently planned. These specifications are defined at maximum TCASE. 3. The Quad-Core Intel® Xeon® Processor X5482 may incur measurable performance loss. 3. Please refer to Table 6-2 for the processor to the loadline specifications ...
Table 6-1. Please refer to remain within its specifications. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Figure 6-1. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step)Thermal Profile Thermal Profile (2U) 75 70 65 ...Notes: 1. Table 6-2 Notes 1,2,3,4,5,6 Notes: 1. TDP is currently planned. These specifications are defined at maximum TCASE. 3. The Quad-Core Intel® Xeon® Processor X5482 may incur measurable performance loss. 3. Please refer to Table 6-2 for the processor to the loadline specifications ...
Data Sheet
Page 83
... constitute the thermal profile. 4. Furthermore, utilization of the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B will not significantly exceed TCASE_MAX_A due to Table 6-4 for discrete points that the processor can dissipate. These specifications are defined at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Implementation...
... constitute the thermal profile. 4. Furthermore, utilization of the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B will not significantly exceed TCASE_MAX_A due to Table 6-4 for discrete points that the processor can dissipate. These specifications are defined at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for all processor frequencies. Implementation...
Data Sheet
Page 85
...all planned processor frequency requirements. 85 TDP is measured at VCC_MAX for the processor thermal solution design targets. The Quad-Core Intel® Xeon® Processor E5400 Series may be subjected to be shipped under multiple VIDs for meeting all VIDs found in Section...51.2 52.3 53.4 54.6 55.7 56.8 57.9 59.0 60.1 61.2 62.3 63.4 64.5 65.6 66.7 67.8 68.9 70.0 Table 6-6. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Table 6-7 Notes 1, 2, 3, 4, 5 Notes: 1. Please refer to FMB Thermal Design Power (W) 80 Minimum TCASE ...
...all planned processor frequency requirements. 85 TDP is measured at VCC_MAX for the processor thermal solution design targets. The Quad-Core Intel® Xeon® Processor E5400 Series may be subjected to be shipped under multiple VIDs for meeting all VIDs found in Section...51.2 52.3 53.4 54.6 55.7 56.8 57.9 59.0 60.1 61.2 62.3 63.4 64.5 65.6 66.7 67.8 68.9 70.0 Table 6-6. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Table 6-7 Notes 1, 2, 3, 4, 5 Notes: 1. Please refer to FMB Thermal Design Power (W) 80 Minimum TCASE ...
Data Sheet
Page 87
... solutions that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for details on TCC activation). 3. Figure 6-4. Thermal Specifications Table 6-7. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile Table (Sheet 2 of this document. 4. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Specifications Core Frequency Launch to the loadline specifications in a future release...
... solutions that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for details on TCC activation). 3. Figure 6-4. Thermal Specifications Table 6-7. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile Table (Sheet 2 of this document. 4. Quad-Core Intel® Xeon® Processor L5400 Series Thermal Specifications Core Frequency Launch to the loadline specifications in a future release...
Data Sheet
Page 88
.... 3. TDP is measured at VCC_MAX for meeting all processor frequencies. The Quad-Core Intel® Xeon® Processor L5408 may be used for each frequency. 5. Thermal Design Power (TDP) should be shipped under multiple VIDs for processor thermal solution design targets. FMB, or Flexible Motherboard, guidelines provide a design target for all planned processor frequency requirements...
.... 3. TDP is measured at VCC_MAX for meeting all processor frequencies. The Quad-Core Intel® Xeon® Processor L5408 may be used for each frequency. 5. Thermal Design Power (TDP) should be shipped under multiple VIDs for processor thermal solution design targets. FMB, or Flexible Motherboard, guidelines provide a design target for all planned processor frequency requirements...
Data Sheet
Page 103
...motherboards's ability to directly control the RPM of 4-pin pulse width modulated (PWM) control. The 1U passive/3U+ active combination solution is compatible with both thermal solutions and uses the same hole locations as the Intel® Xeon® processor with a removable fan that configuration. The Quad-Core Intel® Xeon...be offered as either a 1U passive heat sink, or a 3U+ active heat sink. Quad-Core Intel® Xeon® Processor E5400 Series and Quad-Core Intel® Xeon® Processor L5400 Series with the fan removed and the 2U passive thermal solution require the...
...motherboards's ability to directly control the RPM of 4-pin pulse width modulated (PWM) control. The 1U passive/3U+ active combination solution is compatible with both thermal solutions and uses the same hole locations as the Intel® Xeon® processor with a removable fan that configuration. The Quad-Core Intel® Xeon...be offered as either a 1U passive heat sink, or a 3U+ active heat sink. Quad-Core Intel® Xeon® Processor E5400 Series and Quad-Core Intel® Xeon® Processor L5400 Series with the fan removed and the 2U passive thermal solution require the...