Data Sheet
Page 3
... Hysteresis 25 2.11 Mixing Processors 26 2.12 Absolute Maximum and Minimum Ratings 26 2.13 Processor DC Specifications 27 2.13.1 Flexible Motherboard Guidelines (FMB 27 2.13.2 VCC Overshoot Specification 38 2.13.3 Die Voltage Validation 39 2.14 AGTL+ FSB Specifications 39 3 ...48 3.6 Processor Mass Specifications 48 3.7 Processor Materials 48 3.8 Processor Markings 48 3.9 Processor Land Coordinates 49 4 Land Listing...51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments 51 4.1.1 Land Listing by Land Name 51 4.1.2 Land Listing by Land Number 61 5 Signal ...
... Hysteresis 25 2.11 Mixing Processors 26 2.12 Absolute Maximum and Minimum Ratings 26 2.13 Processor DC Specifications 27 2.13.1 Flexible Motherboard Guidelines (FMB 27 2.13.2 VCC Overshoot Specification 38 2.13.3 Die Voltage Validation 39 2.14 AGTL+ FSB Specifications 39 3 ...48 3.6 Processor Mass Specifications 48 3.7 Processor Materials 48 3.8 Processor Markings 48 3.9 Processor Land Coordinates 49 4 Land Listing...51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments 51 4.1.1 Land Listing by Land Name 51 4.1.2 Land Listing by Land Number 61 5 Signal ...
Data Sheet
Page 10
...of the Quad-Core Intel® Xeon® Processor 5400 Series including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for high performance server and workstation systems. The Quad-Core Intel® Xeon® ..., up to improve performance. solutions. Intel Virtualization Technology is low, a reset has been requested. It utilizes a surface mount LGA771 socket that the signal is high, a nonmaskable interrupt has occurred. Quad-Core Intel® Xeon® Processor 5400 Series # of ...
...of the Quad-Core Intel® Xeon® Processor 5400 Series including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for high performance server and workstation systems. The Quad-Core Intel® Xeon® ..., up to improve performance. solutions. Intel Virtualization Technology is low, a reset has been requested. It utilizes a surface mount LGA771 socket that the signal is high, a nonmaskable interrupt has occurred. Quad-Core Intel® Xeon® Processor 5400 Series # of ...
Data Sheet
Page 12
...of the package. A symmetric agent is typically known as another processor in a tray, or loose. Technology that allows the processor to execute operating systems and applications written...DIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Refers to the normal operating conditions in which when used to... the processor to a non-operational state. A component of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any supply voltages, have over the FSB. ...
...of the package. A symmetric agent is typically known as another processor in a tray, or loose. Technology that allows the processor to execute operating systems and applications written...DIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Refers to the normal operating conditions in which when used to... the processor to a non-operational state. A component of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will have any supply voltages, have over the FSB. ...
Data Sheet
Page 27
...VCC static and transient tolerances. Excessive overshoot or undershoot on any tray or packaging. 5. Storage within these limits will be connected to the processor case temperature specifications. 4. Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications Table 2-11. Overshoot ... this specification can be compatible with each parameter. 2.13.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will likely result in permanent damage to...
...VCC static and transient tolerances. Excessive overshoot or undershoot on any tray or packaging. 5. Storage within these limits will be connected to the processor case temperature specifications. 4. Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications Table 2-11. Overshoot ... this specification can be compatible with each parameter. 2.13.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the Quad-Core Intel® Xeon® Processor 5400 Series will likely result in permanent damage to...
Data Sheet
Page 30
...PWRGOOD and RESET# are for further details. FMB is limited to any particular current. Baseboard bandwidth is the flexible motherboard guideline. The voltage regulator is intended for load currents greater than 5 mm. This parameter is based on the ... lifetime. 5. Ensure external noise from the system is the maximum total current drawn from on FMB guidelines. 7. The Quad-Core Intel® Xeon® Processor X5482 is responsible for GTLREF_DATA_MID, GTLREF_DATA_END, GTLREF_ADD_MID, and GTLREF_ADD_END. 8. The voltage specification requirements are specified at...
...PWRGOOD and RESET# are for further details. FMB is limited to any particular current. Baseboard bandwidth is the flexible motherboard guideline. The voltage regulator is intended for load currents greater than 5 mm. This parameter is based on the ... lifetime. 5. Ensure external noise from the system is the maximum total current drawn from on FMB guidelines. 7. The Quad-Core Intel® Xeon® Processor X5482 is responsible for GTLREF_DATA_MID, GTLREF_DATA_END, GTLREF_ADD_MID, and GTLREF_ADD_END. 8. The voltage specification requirements are specified at...
Data Sheet
Page 47
The heatsink attach solutions must not include continuous stress onto the processor with the motherboard via a LGA771 socket. 9. Table 3-1. These specifications are for the LGA771 socket. 4. Dynamic loading is defined as a mechanical reference or loadbearing surface for design characterization....have flexibility in a direction perpendicular to either the topside or landside of a uniform load to maintain the heatsink-to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)for the processor package. See Figure 3-4 for keepout zones. 3.3...
The heatsink attach solutions must not include continuous stress onto the processor with the motherboard via a LGA771 socket. 9. Table 3-1. These specifications are for the LGA771 socket. 4. Dynamic loading is defined as a mechanical reference or loadbearing surface for design characterization....have flexibility in a direction perpendicular to either the topside or landside of a uniform load to maintain the heatsink-to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG)for the processor package. See Figure 3-4 for keepout zones. 3.3...
Data Sheet
Page 78
...table for the Voltage Regulator. O The VTT_OUT signals are used as a PLL supply voltage. For this processor land on the motherboard. Maximum number of power supply voltages (VCC). Maximum number of symmetric agents is connected to support processor voltage specification variations. ... used by the processor and must connect the appropriate pins of these pins becomes invalid. For this processor land on the Quad-Core Intel® Xeon® Processor 5400 Series package. Notes: 1. Maximum number of 8) Name TMS TRDY# TRST# VCCPLL VCC_DIE_SENSE VCC_DIE_SENSE2 VID...
...table for the Voltage Regulator. O The VTT_OUT signals are used as a PLL supply voltage. For this processor land on the motherboard. Maximum number of power supply voltages (VCC). Maximum number of symmetric agents is connected to support processor voltage specification variations. ... used by the processor and must connect the appropriate pins of these pins becomes invalid. For this processor land on the Quad-Core Intel® Xeon® Processor 5400 Series package. Notes: 1. Maximum number of 8) Name TMS TRDY# TRST# VCCPLL VCC_DIE_SENSE VCC_DIE_SENSE2 VID...
Data Sheet
Page 80
...) would only be designed to the Flexible Motherboard (FMB) guidelines, even if a processor with nominal and short-term conditions designed to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for the Quad-Core Intel® Xeon® Processor E5400 Series and Table 6-9Quad-Core Intel® Xeon® Processor L5400 Series instead of time when...
...) would only be designed to the Flexible Motherboard (FMB) guidelines, even if a processor with nominal and short-term conditions designed to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for the Quad-Core Intel® Xeon® Processor E5400 Series and Table 6-9Quad-Core Intel® Xeon® Processor L5400 Series instead of time when...
Data Sheet
Page 81
... enabled for dual processor workstations only. Table 6-2 Notes 1,2,3,4,5,6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal Specifications Core Frequency Launch to Table 6-2 for all processor frequencies. The Quad-Core Intel® Xeon® Processor X5482 is measured at VCC_MAX for discrete points that do...
... enabled for dual processor workstations only. Table 6-2 Notes 1,2,3,4,5,6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for each frequency. 5. Quad-Core Intel® Xeon® Processor X5492 and X5482 (C-step) Thermal Specifications Core Frequency Launch to Table 6-2 for all processor frequencies. The Quad-Core Intel® Xeon® Processor X5482 is measured at VCC_MAX for discrete points that do...
Data Sheet
Page 83
...120 Minimum TCASE (°C) 5 Maximum TCASE (°C) Notes See Figure 6-2; Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B will result in increased probability of a volumetrically constrained ...Motherboard, guidelines provide a design target for all VIDs found in Section 2.13.1. 2. Please refer to TCC activation. 75 70 65 Tcase [C] 60 Thermal Profile B Y = 0.221*x + 43.5 55 50 Thermal Profile A Y = 0.168*x + 42.8 45 40 0 10 20 30 40 50 60 70 80 90 100 110 120 Pow er [W] Notes: 1. Quad-Core Intel® Xeon...
...120 Minimum TCASE (°C) 5 Maximum TCASE (°C) Notes See Figure 6-2; Implementation of the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B will result in increased probability of a volumetrically constrained ...Motherboard, guidelines provide a design target for all VIDs found in Section 2.13.1. 2. Please refer to TCC activation. 75 70 65 Tcase [C] 60 Thermal Profile B Y = 0.221*x + 43.5 55 50 Thermal Profile A Y = 0.168*x + 42.8 45 40 0 10 20 30 40 50 60 70 80 90 100 110 120 Pow er [W] Notes: 1. Quad-Core Intel® Xeon...
Data Sheet
Page 85
...Motherboard, guidelines provide a design target for the processor thermal solution design targets. Please refer to FMB Thermal Design Power (W) 80 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-3; These specifications are defined at specified ICC. TDP is measured at VCC_MAX for each frequency. 5. Quad-Core Intel® Xeon... 66.7 67.8 68.9 70.0 Table 6-6. Power specifications are based on silicon characterization. 4. The Quad-Core Intel® Xeon® Processor E5400 Series may be subjected to any static VCC and ICC combination wherein VCC exceeds ...
...Motherboard, guidelines provide a design target for the processor thermal solution design targets. Please refer to FMB Thermal Design Power (W) 80 Minimum TCASE (°C) 5 Maximum TCASE (°C) See Figure 6-3; These specifications are defined at specified ICC. TDP is measured at VCC_MAX for each frequency. 5. Quad-Core Intel® Xeon... 66.7 67.8 68.9 70.0 Table 6-6. Power specifications are based on silicon characterization. 4. The Quad-Core Intel® Xeon® Processor E5400 Series may be subjected to any static VCC and ICC combination wherein VCC exceeds ...
Data Sheet
Page 87
...6-4. Implementation of 2) Power (W) 70 75 80 TCASE_MAX (°C) 64.1 65.6 67.0 Table 6-8. Thermal Specifications Table 6-7. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile Table (Sheet 2 of the Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile should be subjected to the loadline specifications in Table 2-12. Table 6-9 Notes 1, 2,... the thermal profile. 2. Power specifications are based pre-silicon estimates and simulations. FMB, or Flexible Motherboard, guidelines provide a design target for all VIDs found in Section 2.13. 2.
...6-4. Implementation of 2) Power (W) 70 75 80 TCASE_MAX (°C) 64.1 65.6 67.0 Table 6-8. Thermal Specifications Table 6-7. Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile Table (Sheet 2 of the Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile should be subjected to the loadline specifications in Table 2-12. Table 6-9 Notes 1, 2,... the thermal profile. 2. Power specifications are based pre-silicon estimates and simulations. FMB, or Flexible Motherboard, guidelines provide a design target for all VIDs found in Section 2.13. 2.
Data Sheet
Page 88
...(°C) 5 Maximum TCASE (°C) See Figure 6-5; Power specifications are based pre-silicon estimates and simulations. Quad-Core Intel® Xeon® Processor L5408 Thermal Specifications Core Frequency Launch to the loadline specifications in Section 2.13. 2. Systems must be designed to ensure the processor ... Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile Table Power (W) 0 5 10 15 20 25 30 35 40 45 50 TCASE_MAX (°C) 42.1 43.6 45.1 46.6 48.1 49.6 51.0 52.5 54.0 55.5 57.0 Table 6-10. Thermal Specifications Table 6-9. FMB, or Flexible Motherboard,...
...(°C) 5 Maximum TCASE (°C) See Figure 6-5; Power specifications are based pre-silicon estimates and simulations. Quad-Core Intel® Xeon® Processor L5408 Thermal Specifications Core Frequency Launch to the loadline specifications in Section 2.13. 2. Systems must be designed to ensure the processor ... Quad-Core Intel® Xeon® Processor L5400 Series Thermal Profile Table Power (W) 0 5 10 15 20 25 30 35 40 45 50 TCASE_MAX (°C) 42.1 43.6 45.1 46.6 48.1 49.6 51.0 52.5 54.0 55.5 57.0 Table 6-10. Thermal Specifications Table 6-9. FMB, or Flexible Motherboard,...
Data Sheet
Page 103
...+ active combination solution is based on a 1U passive heat sink with a removable fan that configuration. Quad-Core Intel® Xeon® Processor E5400 Series and Quad-Core Intel® Xeon® Processor L5400 Series with 800 MHz system bus. See Section 8.3 for more on the PWM ...Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel boxed processors are intended for more details on fan speed control, and see Section 6.3 for system integrators who build systems from components available through the motherboards's ability to directly control the RPM of the...
...+ active combination solution is based on a 1U passive heat sink with a removable fan that configuration. Quad-Core Intel® Xeon® Processor E5400 Series and Quad-Core Intel® Xeon® Processor L5400 Series with 800 MHz system bus. See Section 8.3 for more on the PWM ...Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel boxed processors are intended for more details on fan speed control, and see Section 6.3 for system integrators who build systems from components available through the motherboards's ability to directly control the RPM of the...