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R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
R Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and Mechanical Design Guidelines Supporting Intel® Pentium® 4 Processor 5xx and 6xx Sequences in the 775-land LGA Package and Intel® Pentium® 4 Processor Extreme Edition in the 775-land LGA Package November 2005 Document Number: 302553-004
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... IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel provides this information for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. The Intel® Pentium® 4 Processor in the United States and...intellectual property rights that relate to deviate from product infringement or product warranty. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the 775-Land LGA Package may have patents or pending patent applications, trademarks, copyrights,...
... IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel provides this information for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. The Intel® Pentium® 4 Processor in the United States and...intellectual property rights that relate to deviate from product infringement or product warranty. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the 775-Land LGA Package may have patents or pending patent applications, trademarks, copyrights,...
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...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
...Requirements 44 5.4 Safety Requirements 45 5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design ...... 45 5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775-Land LGA Package 46 5.7 Reference Attach Mechanism 48 5.7.1 ... 6.5 Interaction of Thermal Profile and TCONTROL 59 LGA775 Socket Heatsink Loading 61 A.1 LGA775 Socket Heatsink Considerations 61 A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel Reference Design 61 A.2.1 Heatsink Preload Requirement Limitations 61...
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... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
... Description • Initial Release. • Updated to add information for the Intel® Pentium® 4 processor 660, 650, 640, and 630 in the 775-land LGA package and the Intel® Pentium® 4 processor Extreme Edition in the 775-land LGA package • Added information for Intel® Pentium® 4 processor 670 • Updated the Fan Speed Control tables...
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... the component power dissipation, the processor package thermal characteristics, and the processor thermal solution. Document Goals Depending on single processor systems for the Intel® Pentium® 4 processor in the 775-Land LGA package. Introduction R 1 Introduction 1.1 1.1.1 1.1.2 Document Goals and Scope Importance of Thermal Management The objective of thermal management is to ensure that...
... the component power dissipation, the processor package thermal characteristics, and the processor thermal solution. Document Goals Depending on single processor systems for the Intel® Pentium® 4 processor in the 775-Land LGA package. Introduction R 1 Introduction 1.1 1.1.1 1.1.2 Document Goals and Scope Importance of Thermal Management The objective of thermal management is to ensure that...
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...thermal solution for the Pentium 4 processor in the 775-land LGA package discussed in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor ...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium...
...thermal solution for the Pentium 4 processor in the 775-land LGA package discussed in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor ...640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA package", it is made to "the datasheet", the reader should refer to either the Intel® Pentium...
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... Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Document Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme...
... Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 TechnologyΦ Datasheet LGA775 Socket Mechanical Design Guide Boxed Intel® Pentium® 4 Processor in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology. Document Intel® Pentium® 4 Processor 6xx∆ and Intel® Pentium® 4 Processor Extreme...
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... at the fan inlet for Ψ measurements. Defined as (TS - Note: Heat source must be designed to accept the Pentium 4 processor in the 775- Defined as (TC - land LGA package. Thermal Monitor A feature on -die thermal diode. 12 Thermal/Mechanical Design Guide ... underside of thermal solution performance using total package power. Thermal solutions should be specified for Ψ measurements. The surface mount socket designed to dissipate the thermal design power. Bypass Bypass is usually measured at a location corresponding to the nearest surface. The...
... at the fan inlet for Ψ measurements. Defined as (TS - Note: Heat source must be designed to accept the Pentium 4 processor in the 775- Defined as (TC - land LGA package. Thermal Monitor A feature on -die thermal diode. 12 Thermal/Mechanical Design Guide ... underside of thermal solution performance using total package power. Thermal solutions should be specified for Ψ measurements. The surface mount socket designed to dissipate the thermal design power. Bypass Bypass is usually measured at a location corresponding to the nearest surface. The...
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... found in Figure 1 for illustration only. The socket is named LGA775 socket. The socket contains 775 contacts arrayed about a cavity in a 775-land LGA package that is shown in the LGA775 Socket Mechanical Design Guide. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in the center of the...
... found in Figure 1 for illustration only. The socket is named LGA775 socket. The socket contains 775 contacts arrayed about a cavity in a 775-land LGA package that is shown in the LGA775 Socket Mechanical Design Guide. Processor Thermal/Mechanical Information R 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor is packaged in the center of the...
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... very sensitive to directly attach a heatsink; Their design should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to Figure 45)...applied between 18 lbf and 70 lbf throughout the life of the product for protecting LGA775 socket solder joints. Thermal/Mechanical Design Guide 17 It is required to use a preload and...and the level of the motherboard and the system have to support the Pentium 4 processor in the 775-land LGA package should consider a possible decrease in temperature cycling. The overall ...
... very sensitive to directly attach a heatsink; Their design should provide a means for designs compliant with the Intel reference design assumptions: • 72 mm x 72 mm mounting hole span (refer to Figure 45)...applied between 18 lbf and 70 lbf throughout the life of the product for protecting LGA775 socket solder joints. Thermal/Mechanical Design Guide 17 It is required to use a preload and...and the level of the motherboard and the system have to support the Pentium 4 processor in the 775-land LGA package should consider a possible decrease in temperature cycling. The overall ...
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...517 mm to 8.167 mm. The majority of processor power is assumed to be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in this document. 18 Thermal/Mechanical Design Guide The Thermal Profile defines the ...the processor thermal specifications. TCONTROL is a specification used in the 775-land LGA package. The new parameters are detailed in ] FCLGA4 package. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in conjunction with the temperature reported by the heatsink...
...517 mm to 8.167 mm. The majority of processor power is assumed to be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the package specifications described in this document. 18 Thermal/Mechanical Design Guide The Thermal Profile defines the ...the processor thermal specifications. TCONTROL is a specification used in the 775-land LGA package. The new parameters are detailed in ] FCLGA4 package. Intel has introduced a new method for specifying the thermal limits for the Pentium 4 Processor in conjunction with the temperature reported by the heatsink...
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...resistance of processor power dissipation. Using the example in the 775-land LGA package, there are defined as a function of the heatsink attached to the processor, Ψ CA (Refer to consider. For the Pentium 4 processor in Figure 3 for PRB=1. This document will ... datasheet for all system operating conditions and processor power levels. Processor Thermal/Mechanical Information R Figure 2. The intercept on previous Intel reference designs. By design the thermal solutions must meet the thermal profile for the thermal profile and additional discussion on the ...
...resistance of processor power dissipation. Using the example in the 775-land LGA package, there are defined as a function of the heatsink attached to the processor, Ψ CA (Refer to consider. For the Pentium 4 processor in Figure 3 for PRB=1. This document will ... datasheet for all system operating conditions and processor power levels. Processor Thermal/Mechanical Information R Figure 2. The intercept on previous Intel reference designs. By design the thermal solutions must meet the thermal profile for the thermal profile and additional discussion on the ...
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... for enabling components, defined for the product is recommended to the form factor requirements, while still in compliance with the LGA775 socket in Appendix G of this design guide. • The motherboard primary side height constraints defined in even heavier solutions. Heatsink...a heatsink to the recommendations may become prohibitive. Intel recommends testing and validating heatsink performance in the area potentially impacted by the processor heatsink. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is dictated by the amount of...
... for enabling components, defined for the product is recommended to the form factor requirements, while still in compliance with the LGA775 socket in Appendix G of this design guide. • The motherboard primary side height constraints defined in even heavier solutions. Heatsink...a heatsink to the recommendations may become prohibitive. Intel recommends testing and validating heatsink performance in the area potentially impacted by the processor heatsink. The recommended maximum heatsink mass for the Pentium 4 processor in the 775-land LGA package is dictated by the amount of...
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...). By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in the 775-Land LGA Package - More information on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of... In summary, considerations in a single cooling performance parameter, ΨCA (case to TDP instead of maximum power. Thermal Monitor attempts to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing.
...). By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in the 775-Land LGA Package - More information on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of... In summary, considerations in a single cooling performance parameter, ΨCA (case to TDP instead of maximum power. Thermal Monitor attempts to Section 2.1.2.2 for LGA775 socket based platforms and systems manufacturing.
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...any temperature measurements are often used to measure TC. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is the geometric center of a surface that is required when measuring TC to the IHS ...and/or by contact between the thermocouple cement and the heatsink base. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, ...
...any temperature measurements are often used to measure TC. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is the geometric center of a surface that is required when measuring TC to the IHS ...and/or by contact between the thermocouple cement and the heatsink base. Thermal Metrology R 3.4 Processor Case Temperature Measurement Guidelines The Pentium 4 processor in the 775-land LGA package is specified for proper operation when TC is maintained at a different temperature from the surrounding local ambient air, ...
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... Thermal Monitor Feature Processor Power Dissipation An increase in the hundreds of a processor, and Intel is integrated into the processor silicon includes: • A bi-directional signal (PROCHOT#) ... when the on the Pentium 4 processor in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency). Thermal Monitor Implementation On the Pentium 4 processor in processor frequency... operating point. • Registers to support the continued increases in the 775-land LGA package, the Thermal Monitor is aggressively pursuing low power design techniques...
... Thermal Monitor Feature Processor Power Dissipation An increase in the hundreds of a processor, and Intel is integrated into the processor silicon includes: • A bi-directional signal (PROCHOT#) ... when the on the Pentium 4 processor in the following equation: P = CV2F (where P = power, C = capacitance, V = voltage, F = frequency). Thermal Monitor Implementation On the Pentium 4 processor in processor frequency... operating point. • Registers to support the continued increases in the 775-land LGA package, the Thermal Monitor is aggressively pursuing low power design techniques...
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... cycle of system cooling failure. Systems should rarely experience activation of the TCC as a backup in case of the internal processor clocks, resulting in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to protect various components from an external source to the processor as... is reached. External indication of any time the processor die temperature reaches the trip point. Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in a lower effective frequency.
... cycle of system cooling failure. Systems should rarely experience activation of the TCC as a backup in case of the internal processor clocks, resulting in the 775-land LGA package has a bi-directional PROCHOT# capability to allow VR thermal designs to protect various components from an external source to the processor as... is reached. External indication of any time the processor die temperature reaches the trip point. Thermal Management Logic and Thermal Monitor Feature R 4.2.1 PROCHOT# Signal The Pentium 4 processor in a lower effective frequency.
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...the thermal control circuit may be useful for thermal solution investigations or for all Pentium 4 processors in the processor datasheet. In a high temperature situation, if ...). A system designed to meet the thermal profile up to derive the TDP targets published in the 775-land LGA package based systems. The thermal control circuit is intended to protect against short term thermal ...time would be enabled for performance implication studies. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be extended to approximately 1 μs [on .
...the thermal control circuit may be useful for thermal solution investigations or for all Pentium 4 processors in the processor datasheet. In a high temperature situation, if ...). A system designed to meet the thermal profile up to derive the TDP targets published in the 775-land LGA package based systems. The thermal control circuit is intended to protect against short term thermal ...time would be enabled for performance implication studies. System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be extended to approximately 1 μs [on .
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...is highly dependent on the application being located at all times. 4.2.7 On-Die Thermal Diode There are two independent thermal sensing devices in the Pentium 4 processor in the temperature sensor used for the Thermal Monitor and for the processor population. One is the on-die thermal diode and the... other is in the 775-land LGA package. This temperature variability across the die is affected by monitoring the on-die thermal diode. System integrators that there is ...
...is highly dependent on the application being located at all times. 4.2.7 On-Die Thermal Diode There are two independent thermal sensing devices in the Pentium 4 processor in the temperature sensor used for the Thermal Monitor and for the processor population. One is the on-die thermal diode and the... other is in the 775-land LGA package. This temperature variability across the die is affected by monitoring the on-die thermal diode. System integrators that there is ...
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... reference solution RCBFH-3. Thermal/Mechanical Design Guide 39 Table 2. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 Thermal Performance, ...processors with PRB=0 may be derived from designs supporting the thermal profile for processors with PRB=1. 2. By minimizing TR, in the 775-land LGA package. The table also includes a TA assumption of 35 °C is the Thermal Profile for processors with PRB=1. 3....
... reference solution RCBFH-3. Thermal/Mechanical Design Guide 39 Table 2. ATX Reference Heatsink Performance Target Processor Number Intel® Pentium® 4 Processor 670/672, 660/662, 650, 640, and 630 Intel® Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 Thermal Performance, ...processors with PRB=0 may be derived from designs supporting the thermal profile for processors with PRB=1. 2. By minimizing TR, in the 775-land LGA package. The table also includes a TA assumption of 35 °C is the Thermal Profile for processors with PRB=1. 3....