User Guide
Page 28
Using an open bench to characterize an active heatsink can be taped directly to the barrier with significant elements like memory cards, graphic card, and chipset heatsink. If a barrier is used by the fan to check its maximum capability. If a variable speed fan is used, it may be ...
Using an open bench to characterize an active heatsink can be taped directly to the barrier with significant elements like memory cards, graphic card, and chipset heatsink. If a barrier is used by the fan to check its maximum capability. If a variable speed fan is used, it may be ...
User Guide
Page 91
...know the system into which the processor power may be low but other subsystems (e.g., memory, graphics) are reflected in the Flotherm thermal model airflow illustrations (see Figure 43 and Figure 44).The Intel® Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The... a board will increase when other system component powers may be useful to monitor the temperature near the PSU airflow inlet, near the graphics add-in card, or near critical components should be assessed for a range of system external temperatures, component powers, and fan speed ...
...know the system into which the processor power may be low but other subsystems (e.g., memory, graphics) are reflected in the Flotherm thermal model airflow illustrations (see Figure 43 and Figure 44).The Intel® Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The... a board will increase when other system component powers may be useful to monitor the temperature near the PSU airflow inlet, near the graphics add-in card, or near critical components should be assessed for a range of system external temperatures, component powers, and fan speed ...
User Guide
Page 92
System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module Figure 44. Balanced Technology Extended (BTX) System Thermal Considerations R Figure 43. Thermal Sensor Location Illustration OM16791 Thermal Sensor TMA Airflow MCH Heatsink 92 Thermal/Mechanical Design Guide
System Airflow Illustration with System Monitor Point Area Identified Power Supply Unit Graphics Add-In Card Memory Monitor Point MCH Thermal Module Figure 44. Balanced Technology Extended (BTX) System Thermal Considerations R Figure 43. Thermal Sensor Location Illustration OM16791 Thermal Sensor TMA Airflow MCH Heatsink 92 Thermal/Mechanical Design Guide