Design Guide
Page 6
... to the LGA775 Socket 94 Figure 7-16. Intel® QST Platform Requirements 72 Figure 7-4. Bottom View of the Thermocouple 96 Figure 7-18. Critical Core Dimension 67 Figure ...7-1. E18764-001 Reference Design - TCONTROL for Interfacing to -SRM Interface Features ......53 Figure 6-1. Inspection of Insulation on Thermocouple 95 Figure 7-17. Random Vibration PSD 47 Figure 5-3. Processor Case Temperature Measurement Location 19 Figure 2-3. Intel Type II TMA 65W Reference Design 50 Figure 5-5. Omega Thermocouple 90 Figure 7-12. 775-LAND LGA...
... to the LGA775 Socket 94 Figure 7-16. Intel® QST Platform Requirements 72 Figure 7-4. Bottom View of the Thermocouple 96 Figure 7-18. Critical Core Dimension 67 Figure ...7-1. E18764-001 Reference Design - TCONTROL for Interfacing to -SRM Interface Features ......53 Figure 6-1. Inspection of Insulation on Thermocouple 95 Figure 7-17. Random Vibration PSD 47 Figure 5-3. Processor Case Temperature Measurement Location 19 Figure 2-3. Intel Type II TMA 65W Reference Design 50 Figure 5-5. Omega Thermocouple 90 Figure 7-12. 775-LAND LGA...
Design Guide
Page 14
...accept the processors in the 775-Land LGA package. Defined as (TC - Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that attempts to keep the processor die temperature within factory specifications. The surface mount socket designed to -ambient thermal...heatsink, fan and duct assembly for Ψ measurements. Introduction Term Description ΨCS ΨSA TIM P MAX TDP IHS LGA775 Socket Case-to a thermal solution through heat spreading. A measure of the PWM signal. Thermal Design Power: a power dissipation target based on...
...accept the processors in the 775-Land LGA package. Defined as (TC - Thermal Interface Material: The thermally conductive compound between a passive heatsink and any object that attempts to keep the processor die temperature within factory specifications. The surface mount socket designed to -ambient thermal...heatsink, fan and duct assembly for Ψ measurements. Introduction Term Description ΨCS ΨSA TIM P MAX TDP IHS LGA775 Socket Case-to a thermal solution through heat spreading. A measure of the PWM signal. Thermal Design Power: a power dissipation target based on...
Design Guide
Page 15
... in Figure 2-1 for illustration only. The processor connects to the datasheet for detailed mechanical specifications. Refer to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in the center of IHS to install a heatsink IHS Step to the processor datasheet for surface mounting to the...
... in Figure 2-1 for illustration only. The processor connects to the datasheet for detailed mechanical specifications. Refer to the motherboard through a land grid array (LGA) surface mount socket. The socket contains 775 contacts arrayed about a cavity in the center of IHS to install a heatsink IHS Step to the processor datasheet for surface mounting to the...
Design Guide
Page 18
...of the processor IHS above , the heatsink attach mechanism for information only, and should be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the temperature reported by the heatsink attach mechanism must comply with a 28.7 mm x 28.7 mm [1.13 ... scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-Land LGA processor package with the package specifications described in ] IHS top surface. TCONTROL is usually minimal. For illustration, Figure 2-2 shows the measurement location...
...of the processor IHS above , the heatsink attach mechanism for information only, and should be installed after reflow, given in the LGA775 Socket Mechanical Design Guide with the temperature reported by the heatsink attach mechanism must comply with a 28.7 mm x 28.7 mm [1.13 ... scratching the motherboard. 2.2 Thermal Requirements Refer to the datasheet for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775-Land LGA processor package with the package specifications described in ] IHS top surface. TCONTROL is usually minimal. For illustration, Figure 2-2 shows the measurement location...
Design Guide
Page 25
..., system designers may be appropriate for all capable of dissipating additional heat. These parameters are all aspects LGA775 socket based platforms and systems manufacturing. More information on thermal solutions, the Thermal Monitor feature and associated logic have ...each of these solutions may reduce thermal solution cost by the system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for a particular system implementation. To develop a reliable, cost-effective...
..., system designers may be appropriate for all capable of dissipating additional heat. These parameters are all aspects LGA775 socket based platforms and systems manufacturing. More information on thermal solutions, the Thermal Monitor feature and associated logic have ...each of these solutions may reduce thermal solution cost by the system System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for a particular system implementation. To develop a reliable, cost-effective...
Design Guide
Page 32
The measurement location for TC is the geometric center of a 775-Land LGA processor package for TC measurement. Thermocouples are made, the thermocouples must be calibrated, and the complete measurement system must be routinely checked against known standards. ... by contact between the junction of the thermocouple and the surface of the LGA775 socket for which it is intended. § 32 Thermal and Mechanical Design Guidelines This procedure takes into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by...
The measurement location for TC is the geometric center of a 775-Land LGA processor package for TC measurement. Thermocouples are made, the thermocouples must be calibrated, and the complete measurement system must be routinely checked against known standards. ... by contact between the junction of the thermocouple and the surface of the LGA775 socket for which it is intended. § 32 Thermal and Mechanical Design Guidelines This procedure takes into account the specific features of the 775-Land LGA package and of the integrated heat spreader, heat loss by radiation, convection, by...
Design Guide
Page 39
...of the TCC. Figure 4-3. The PECI interface and the Manageability Engine are relative to the Intel® Quiet System Technology (Intel® Thermal and Mechanical Design Guidelines 39 Readings from previous product. Intel chipsets beginning with the ICH8 have both the DTS and thermal diode. The calculation of ...DTS) as the on-die sensor to sum with the TOFFSET located in the same MSR as with the on pin G5 of the LGA 775 socket. The DTS value where TCC activation occurs is a proprietary single wire bus between the processor and the chipset or other health monitoring device...
...of the TCC. Figure 4-3. The PECI interface and the Manageability Engine are relative to the Intel® Quiet System Technology (Intel® Thermal and Mechanical Design Guidelines 39 Readings from previous product. Intel chipsets beginning with the ICH8 have both the DTS and thermal diode. The calculation of ...DTS) as the on-die sensor to sum with the TOFFSET located in the same MSR as with the on pin G5 of the LGA 775 socket. The DTS value where TCC activation occurs is a proprietary single wire bus between the processor and the chipset or other health monitoring device...
Design Guide
Page 57
... - Note: Development vendor information for the processor in the 775-Land LGA package. Note: If this fan design is provided in your product and you will deliver it to end use customers, you have the responsibility to determine an adequate level of Copper Core Applied by the user during user servicing. Thermal and...
... - Note: Development vendor information for the processor in the 775-Land LGA package. Note: If this fan design is provided in your product and you will deliver it to end use customers, you have the responsibility to determine an adequate level of Copper Core Applied by the user during user servicing. Thermal and...
Design Guide
Page 73
... PECI or SST for placement). Contact your design. Thermal and Mechanical Design Guidelines 73 Example Acoustic Fan Speed Control Implementation Intel has engaged with Digital thermal sensor or a thermal diode. Figure 7-4. In this configuration a SST Thermal Sensor has been...(see Appendix F for BTX recommendations for the processor socket. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo processor.
... PECI or SST for placement). Contact your design. Thermal and Mechanical Design Guidelines 73 Example Acoustic Fan Speed Control Implementation Intel has engaged with Digital thermal sensor or a thermal diode. Figure 7-4. In this configuration a SST Thermal Sensor has been...(see Appendix F for BTX recommendations for the processor socket. Intel® Quiet System Technology (Intel® QST) Figure 7-4 shows the major connections for a typical implementation that is in all of the processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo processor.
Design Guide
Page 89
...the groove and attaching a thermocouple to the IHS followed by the reference procedure. The following table as a convenience to Intel's general customers and the list may be subject to change without notice. Item Microscope DMM Thermal Meter Heater Block Heater ... and of a 775-land LGA package for TC measurement. Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 D.2 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of the LGA775 socket for which it is intended. In addition a ...
...the groove and attaching a thermocouple to the IHS followed by the reference procedure. The following table as a convenience to Intel's general customers and the list may be subject to change without notice. Item Microscope DMM Thermal Meter Heater Block Heater ... and of a 775-land LGA package for TC measurement. Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology D.1 D.2 Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of the LGA775 socket for which it is intended. In addition a ...
Design Guide
Page 92
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines
Design Guide
Page 93
Case Temperature Reference Metrology Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines 93
Case Temperature Reference Metrology Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit (Old Drawing) Thermal and Mechanical Design Guidelines 93
Design Guide
Page 94
... the impact of the groove on the IHS under the socket load such that is capable of an ungrooved IHS on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-15. IHS groove geometry is critical... for compliance to the LGA775 Socket Select a machine shop that it does not ...
... the impact of the groove on the IHS under the socket load such that is capable of an ungrooved IHS on the 775-LAND LGA Package IHS Groove Pin1 indicator When the processor is installed in Figure 7-14 for the 775-Land LGA package IHS. Figure 7-15. IHS groove geometry is critical... for compliance to the LGA775 Socket Select a machine shop that it does not ...
Design Guide
Page 109
...-MAX is not exceeded for the processor. The slope of a fan is the upper limit on -die thermal diode for all earlier processors in the 775-land LGA package • A motherboard with a 4 pin fan header for the specific values. Chapter 5 and 6 discussed in the hub of the thermal profile will , by design...
...-MAX is not exceeded for the processor. The slope of a fan is the upper limit on -die thermal diode for all earlier processors in the 775-land LGA package • A motherboard with a 4 pin fan header for the specific values. Chapter 5 and 6 discussed in the hub of the thermal profile will , by design...