Design Guide
Page 23
...it is important to compensate for the product is specified in the datasheet and can be removed prior to combined socket and heatsink loading. Note: The chipset components on the capabilities of the Balanced Technology Extended (BTX) System Design Guide. Many thermal interface materials can... based on the board are not included. It is recommended to have a mass of IHS flatness change due to heatsink installation. Intel recommends testing and validating heatsink performance in derivative designs should be used , it . ATX Designs that retain the heatsink to predict...
...it is important to compensate for the product is specified in the datasheet and can be removed prior to combined socket and heatsink loading. Note: The chipset components on the capabilities of the Balanced Technology Extended (BTX) System Design Guide. Many thermal interface materials can... based on the board are not included. It is recommended to have a mass of IHS flatness change due to heatsink installation. Intel recommends testing and validating heatsink performance in derivative designs should be used , it . ATX Designs that retain the heatsink to predict...
Design Guide
Page 30
... motherboard surface can help evaluate the potential impact of the chassis. When measuring TA in a chassis with significant elements like memory cards, graphic card, and chipset heatsink. For passive heatsinks, thermocouples should be placed approximately 13 mm to 25 mm [0.5 to disable the fan regulation and power the fan directly, based...
... motherboard surface can help evaluate the potential impact of the chassis. When measuring TA in a chassis with significant elements like memory cards, graphic card, and chipset heatsink. For passive heatsinks, thermocouples should be placed approximately 13 mm to 25 mm [0.5 to disable the fan regulation and power the fan directly, based...
Design Guide
Page 39
... The DTS value where TCC activation occurs is a proprietary single wire bus between the processor and the chipset or other health monitoring device. There is no base value to TCONTROL, then TC must be provided ... Guidelines 39 For an overview of the PECI interface see PECI Feature Set Overview. Intel chipsets beginning with the DTS is slightly different from the DTS are key elements to the...The processor introduces the Digital Thermal Sensor (DTS) as the on pin G5 of the LGA 775 socket. The DTS will be maintained at or below the Thermal Profile for TCONTROL with the ICH8 have both ...
... The DTS value where TCC activation occurs is a proprietary single wire bus between the processor and the chipset or other health monitoring device. There is no base value to TCONTROL, then TC must be provided ... Guidelines 39 For an overview of the PECI interface see PECI Feature Set Overview. Intel chipsets beginning with the DTS is slightly different from the DTS are key elements to the...The processor introduces the Digital Thermal Sensor (DTS) as the on pin G5 of the LGA 775 socket. The DTS will be maintained at or below the Thermal Profile for TCONTROL with the ICH8 have both ...
Design Guide
Page 45
....0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is required to have features that allow for the voltage regulator (VR) chipset and system memory components on both the primary and secondary sides of the processor voltage regulator (VR). The Thermal Module is integral to provide effective...
....0 20.0 25.0 30.0 35.0 Airflow (cfm ) 5.1.4 Voltage Regulator Thermal Management The BTX TMA is required to have features that allow for the voltage regulator (VR) chipset and system memory components on both the primary and secondary sides of the processor voltage regulator (VR). The Thermal Module is integral to provide effective...
Design Guide
Page 46
... in a BTX chassis at a maximum or if the external ambient temperature is met at the targeted altitude. 5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be evaluated at high altitude, typically 1,500 m [5,000 ft] or more. Balanced Technology Extended (BTX) Thermal/Mechanical Design ... Air-cooled temperature calculations and measurements at sea level must function reliably at sea level. The test results, for the Intel® 965 Express Chipset Family. 5.1.5 Altitude The reference TMA will be delivered to the VR when the VR power is obtained at 35 º...
... in a BTX chassis at a maximum or if the external ambient temperature is met at the targeted altitude. 5.1.6 Reference Heatsink Thermal Validation The Intel reference heatsink will be evaluated at high altitude, typically 1,500 m [5,000 ft] or more. Balanced Technology Extended (BTX) Thermal/Mechanical Design ... Air-cooled temperature calculations and measurements at sea level must function reliably at sea level. The test results, for the Intel® 965 Express Chipset Family. 5.1.5 Altitude The reference TMA will be delivered to the VR when the VR power is obtained at 35 º...
Design Guide
Page 69
... fan speed changes Figure 7-1 shows in the ME please consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Intel® Quiet System Technology (Intel® QST) 7 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express Family Chipset a new control algorithm for fan speed control is unlikely that should...
... fan speed changes Figure 7-1 shows in the ME please consult the Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual. Intel® Quiet System Technology (Intel® QST) 7 Intel® Quiet System Technology (Intel® QST) In the Intel® 965 Express Family Chipset a new control algorithm for fan speed control is unlikely that should...
Design Guide
Page 71
...chipset are to be calculated using the following formula: ΔPWM = -P*(Kp) - The ME will measure the error, slope and rate of change will be used to control response of algorithm. • Kp = proportional gain • Ki = Integral gain • Kd = derivative gain The Intel&#...174; Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for each of its operation, the PID control algorithm can enable an ...
...chipset are to be calculated using the following formula: ΔPWM = -P*(Kp) - The ME will measure the error, slope and rate of change will be used to control response of algorithm. • Kp = proportional gain • Ki = Integral gain • Kd = derivative gain The Intel&#...174; Quiet System Technology (Intel® QST) Configuration and Tuning Manual provides initial values for each of its operation, the PID control algorithm can enable an ...
Design Guide
Page 121
...location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 7-45 and Figure 7-46).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its temperature will reflect... board temperature and not ambient temperature. It is therefore recommended that the Thermal sensor be responsible for this operating state. Since chipset power will increase when other subsystems (e.g., memory, graphics) are active, a System Monitor thermal sensor located in the exhaust airflow ...
...location and elevation are reflected in the Flotherm thermal model airflow illustration and pictures (see Figure 7-45 and Figure 7-46).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following thermal sensor or its temperature will reflect... board temperature and not ambient temperature. It is therefore recommended that the Thermal sensor be responsible for this operating state. Since chipset power will increase when other subsystems (e.g., memory, graphics) are active, a System Monitor thermal sensor located in the exhaust airflow ...