Mechanical Design Guidelines
Page 4
...43 5.2.1.2 Shock Test Procedure 44 5.2.2 Power Cycling 45 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA ...55 6.3.1.2 Shock Test Procedure 56 6.3.2 Power Cycling 57 6.3.3 Recommended BIOS/CPU/Memory Test Procedures 58 6.4 Material and Recycling Requirements 58 6.5 Safety Requirements 59 6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design.....59 6.7 Reference Attach Mechanism 60...
...43 5.2.1.2 Shock Test Procedure 44 5.2.2 Power Cycling 45 5.2.3 Recommended BIOS/CPU/Memory Test Procedures 46 5.3 Material and Recycling Requirements 46 5.4 Safety Requirements 47 5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly ......47 5.6 Preload and TMA ...55 6.3.1.2 Shock Test Procedure 56 6.3.2 Power Cycling 57 6.3.3 Recommended BIOS/CPU/Memory Test Procedures 58 6.4 Material and Recycling Requirements 58 6.5 Safety Requirements 59 6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design.....59 6.7 Reference Attach Mechanism 60...
Mechanical Design Guidelines
Page 45
...to its bottom remains mated flatly against IHS surface. No visible tilt of the heatsink with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to any reliability testing. The test is evaluated using power cycling testing. The test sequence should be followed by ... is to impact of post-test samples. 7. No significant physical damage to the maximum case temperature defined by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. The stress test should always start with components (that is...
...to its bottom remains mated flatly against IHS surface. No visible tilt of the heatsink with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to any reliability testing. The test is evaluated using power cycling testing. The test sequence should be followed by ... is to impact of post-test samples. 7. No significant physical damage to the maximum case temperature defined by a visual inspection and then BIOS/CPU/Memory test. 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. The stress test should always start with components (that is...
Mechanical Design Guidelines
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... • DIMM • Keyboard • Monitor The pass criterion is to the test being considered. Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 5.3 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of tests prior to ensure proper operation of the...
... • DIMM • Keyboard • Monitor The pass criterion is to the test being considered. Balanced Technology Extended (BTX) Thermal/Mechanical Design Information 5.2.3 5.3 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of tests prior to ensure proper operation of the...
Mechanical Design Guidelines
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... for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Successful BIOS/Processor/memory test of heatsink or heatsink...4. ATX Thermal/Mechanical Design Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Thermal compliance testing to demonstrate that is to account for 72 hours at TDP. No signs of...
... for the case temperature from room temperature (~23 ºC) to the maximum case temperature defined by a visual inspection and then BIOS/CPU/Memory test. 6.3.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. Successful BIOS/Processor/memory test of heatsink or heatsink...4. ATX Thermal/Mechanical Design Information 6.3.1.2.1 Recommended Test Sequence Each test sequence should start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 6.3.3). Thermal compliance testing to demonstrate that is to account for 72 hours at TDP. No signs of...
Mechanical Design Guidelines
Page 58
... Requirements Material shall be recyclable per the European Blue Angel recycling standards. 58 Thermal and Mechanical Design Guidelines ATX Thermal/Mechanical Design Information 6.3.3 6.4 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any...
... Requirements Material shall be recyclable per the European Blue Angel recycling standards. 58 Thermal and Mechanical Design Guidelines ATX Thermal/Mechanical Design Information 6.3.3 6.4 Recommended BIOS/CPU/Memory Test Procedures This test is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any...
Mechanical Design Guidelines
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... BALL 1 ( 19.13 ) PACKAGE BOUNDARY A NOTES: 1. P.O. Mechanical Drawings Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE THIRD ANGLE PROJECTION APPROVED BY DATE LGA775 microATX APPROVED BY DATE MATERIAL: N/A FINISH: N/A COMPONENT KEEP-INS SIZE CAGE...-1994 DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE CHECKED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD. CORP. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3.
... BALL 1 ( 19.13 ) PACKAGE BOUNDARY A NOTES: 1. P.O. Mechanical Drawings Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components - BOX 58119 A SANTA CLARA, CA 95052-8119 TITLE THIRD ANGLE PROJECTION APPROVED BY DATE LGA775 microATX APPROVED BY DATE MATERIAL: N/A FINISH: N/A COMPONENT KEEP-INS SIZE CAGE...-1994 DIMENSIONS ARE IN MILLIMETERS DESIGNED BY DATE CHECKED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD. CORP. DIMENSIONS ARE IN MILLIMETERS. 2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY. 3.
Mechanical Design Guidelines
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... SPLAYED OR MODIFIED, WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C... THE SOCKET NOMINAL VOLUME AND ALLOWANCES FOR SIZE TOLERANCES. A 2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION. BOX 58119 SANTA CLARA, CA 95052-8119 2 SIZE CAGE CODE DRAWING NUMBER REV D C40819 3 SCALE: NONE DONOT SCALE DRAWING SHEET...
... SPLAYED OR MODIFIED, WITHOUT THE PRI 49.00 24.50 19.25 3.00 A 6 5 4 DISCLOSED IN CONFIDENCE AND ITS CONT ENTS OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2X SOCKET & PROCESSOR VOLUMETRIC KEEP-IN 45 X 3.00 29.00 R49.44 R33.29 ( 37.60 ) 14.10 6.60 2.75 C... THE SOCKET NOMINAL VOLUME AND ALLOWANCES FOR SIZE TOLERANCES. A 2 SOCKET KEEP-IN VOLUME VERTICAL HEIGHT ESTABLISHES LIMIT OF SOCKET AND CPU PACKAGE ASSEMBLY IN THE SOCKET LOCKED DOWN POSITION. BOX 58119 SANTA CLARA, CA 95052-8119 2 SIZE CAGE CODE DRAWING NUMBER REV D C40819 3 SCALE: NONE DONOT SCALE DRAWING SHEET...