Data Sheet
Page 3
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
... Signals 22 2.8 Test Access Port (TAP) Connection 22 2.9 Mixing Processors 23 2.10 Absolute Maximum and Minimum Ratings 23 2.11 Processor DC Specifications 24 2.11.1 Flexible Motherboard Guidelines (FMB 25 2.11.2 Platform Environmental Control Interface (PECI) DC Specifications 35 2.11.3 VCC Overshoot Specification 37 2.11.4 AGTL+ FSB Specifications 38 2.12 Front Side...
Data Sheet
Page 10
...KB data 4M L2 Cache per die 8M Total Cache Front Side Bus Frequency 1066 MHz Package FC-mPGA6 Intel® Xeon® Processor 7200 Series and 7300 Series-based platforms implement independent core voltage (VCC) power planes for high performance multi-processor server systems. The...(see Section 2.11.1). The FSB is used to deliver interrupts. 10 Document Number: 318080-002 Components of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for hardware-assisted virtualization within...
...KB data 4M L2 Cache per die 8M Total Cache Front Side Bus Frequency 1066 MHz Package FC-mPGA6 Intel® Xeon® Processor 7200 Series and 7300 Series-based platforms implement independent core voltage (VCC) power planes for high performance multi-processor server systems. The...(see Section 2.11.1). The FSB is used to deliver interrupts. 10 Document Number: 318080-002 Components of the processors including Flexible Motherboard Guidelines (FMB) (see Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.0 Design Guidelines for hardware-assisted virtualization within...
Data Sheet
Page 11
...integrity specifications are satisfied. • Storage Conditions - The MIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Refers to the normal operating conditions in the asserted state when driven to a hex 'A' (H= High logic level, L=... an active low signal, indicating a signal is in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any I /O transactions as well as the processor system bus or the system bus. For ...
...integrity specifications are satisfied. • Storage Conditions - The MIB architecture provides improved performance by allowing increased FSB speeds and bandwidth. • Flexible Motherboard Guidelines (FMB) - Refers to the normal operating conditions in the asserted state when driven to a hex 'A' (H= High logic level, L=... an active low signal, indicating a signal is in which extends power management capabilities of the maximum values the Intel® Xeon® Processor 7200, 7300 Series will have any I /O transactions as well as the processor system bus or the system bus. For ...
Data Sheet
Page 25
...; Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series will be compatible with future processors. System designers should meet the FMB values to the FMB value in the foreseeable future. Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications...
...; Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series will be compatible with future processors. System designers should meet the FMB values to the FMB value in the foreseeable future. Electrical Specifications 2.11.1 Flexible Motherboard Guidelines (FMB) The Flexible Motherboard (FMB) guidelines are only estimates and actual specifications...
Data Sheet
Page 26
.... FMB is measured at a later date. 2. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - These specifications will be drawn from the system is based on FMB guidelines...stable ICC_TDC ICC_TDC ICC_TDC ICC_TDC ICC_VTT_OUT ICC_GTLREF ICC_VCCPLL ITCC ITCC ITCC ITCC Thermal Design Current (TDC) QuadCore Intel® Xeon® L7345 Processor Launch - This specification represents the total current for more information.... only. This specification is the flexible motherboard guideline. Electrical Specifications Table 2-9.
.... FMB is measured at a later date. 2. FMB Thermal Design Current (TDC) Intel® Xeon® Processor 7200 Series and 7300 Series Launch - These specifications will be drawn from the system is based on FMB guidelines...stable ICC_TDC ICC_TDC ICC_TDC ICC_TDC ICC_VTT_OUT ICC_GTLREF ICC_VCCPLL ITCC ITCC ITCC ITCC Thermal Design Current (TDC) QuadCore Intel® Xeon® L7345 Processor Launch - This specification represents the total current for more information.... only. This specification is the flexible motherboard guideline. Electrical Specifications Table 2-9.
Data Sheet
Page 57
... Assembly Sketch Note: 3.1 Figure 3-1 is not to the package substrate and die and serves as a heatsink. Package reference with the motherboard via a mPGA604 socket. Top-side and back-side component keepout dimensions 5. FC-mPGA6 package 4. The package components shown in Figure 3-2... as the mating surface for reference only. IHS parallelism and tilt 3. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is packaged in ]. Reference datums All drawing dimension are assembled together. Figure 3-1 shows a sketch of...
... Assembly Sketch Note: 3.1 Figure 3-1 is not to the package substrate and die and serves as a heatsink. Package reference with the motherboard via a mPGA604 socket. Top-side and back-side component keepout dimensions 5. FC-mPGA6 package 4. The package components shown in Figure 3-2... as the mating surface for reference only. IHS parallelism and tilt 3. Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is packaged in ]. Reference datums All drawing dimension are assembled together. Figure 3-1 shows a sketch of...
Data Sheet
Page 96
... document. 5. Systems must be met to ensure adherence to the Dual-Core Intel® Xeon® Processor 7200 Series and QuadCore Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for sustained time periods. Maximum Power is... thermal solution design, thermal profiles and environmental considerations. Intel has developed the thermal profile to allow customers to TCC activation (see Figure 6-2; FMB, or Flexible Motherboard, guidelines provide a design target for QuadCore Intel® Xeon® X7350 Processor). Thermal Specifications Additionally...
... document. 5. Systems must be met to ensure adherence to the Dual-Core Intel® Xeon® Processor 7200 Series and QuadCore Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for sustained time periods. Maximum Power is... thermal solution design, thermal profiles and environmental considerations. Intel has developed the thermal profile to allow customers to TCC activation (see Figure 6-2; FMB, or Flexible Motherboard, guidelines provide a design target for QuadCore Intel® Xeon® X7350 Processor). Thermal Specifications Additionally...
Data Sheet
Page 97
...measured at all planned processor frequency requirements. TDP is not the maximum power that the processor can dissipate. The Quad-Core Intel® Xeon® E7300 Processor may incur measurable performance loss. (See Section 6.2 for processor thermal solution design targets. Implementation... will result in Table 2-3. Table 6-2. Furthermore, utilization of thermal solutions that constitute the thermal profile. 2. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all VIDs found in increased probability of TCC activation and may be used for details on...
...measured at all planned processor frequency requirements. TDP is not the maximum power that the processor can dissipate. The Quad-Core Intel® Xeon® E7300 Processor may incur measurable performance loss. (See Section 6.2 for processor thermal solution design targets. Implementation... will result in Table 2-3. Table 6-2. Furthermore, utilization of thermal solutions that constitute the thermal profile. 2. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all VIDs found in increased probability of TCC activation and may be used for details on...
Data Sheet
Page 98
... highest power the processor will be used for details on TCC activation). 3. Maximum Power is measured at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that the processor can dissipate. TDP is measured at maximum TCASE. 4. Notes 1, 2, 3, ... result in Section 2. 2. Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for ...
... highest power the processor will be used for details on TCC activation). 3. Maximum Power is measured at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that the processor can dissipate. TDP is measured at maximum TCASE. 4. Notes 1, 2, 3, ... result in Section 2. 2. Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications Core Frequency Launch to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for ...
Data Sheet
Page 99
... TCASE (°C) Notes See Figure 6-3; 1, 2, 3, 4, 5, 6 Table 6-6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for processor thermal solution design targets. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 90...58.0 59.6 61.2 62.8 64.4 66.0 Table 6-5. TDP is measured at maximum TCASE. 4. Thermal Specifications Table 6-4. The Quad-Core Intel® Xeon® L7345 Processor may be used for meeting all VIDs found in Section 2. 2. Power specifications are based on initial silicon...
... TCASE (°C) Notes See Figure 6-3; 1, 2, 3, 4, 5, 6 Table 6-6 Notes: 1. FMB, or Flexible Motherboard, guidelines provide a design target for processor thermal solution design targets. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 90...58.0 59.6 61.2 62.8 64.4 66.0 Table 6-5. TDP is measured at maximum TCASE. 4. Thermal Specifications Table 6-4. The Quad-Core Intel® Xeon® L7345 Processor may be used for meeting all VIDs found in Section 2. 2. Power specifications are based on initial silicon...
Data Sheet
Page 101
... be updated with characterized data from silicon measurements in virtually no TCC activation. Maximum Power is measured at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Notes 1, 2, 3, 4, 5, 6 Notes: 1. TDP ... its VID. Thermal Specifications Table 6-7. Please refer to Table 6-8 for meeting all planned processor frequency requirements. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications Core Frequency Launch to be used for all VIDs found in Section ...
... be updated with characterized data from silicon measurements in virtually no TCC activation. Maximum Power is measured at maximum TCASE. 3. FMB, or Flexible Motherboard, guidelines provide a design target for discrete points that constitute the thermal profile. 2. Notes 1, 2, 3, 4, 5, 6 Notes: 1. TDP ... its VID. Thermal Specifications Table 6-7. Please refer to Table 6-8 for meeting all planned processor frequency requirements. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications Core Frequency Launch to be used for all VIDs found in Section ...
Data Sheet
Page 102
... the processor integrated heat spreader (IHS). TDP is not the maximum power that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all VIDs found in Table 2-3. Figure 6-5 illustrates the location where TCASE temperature measurements... be made. For detailed guidelines on temperature measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 Thermal Specifications 3. ...
... the processor integrated heat spreader (IHS). TDP is not the maximum power that the processor can dissipate. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all VIDs found in Table 2-3. Figure 6-5 illustrates the location where TCASE temperature measurements... be made. For detailed guidelines on temperature measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002 Thermal Specifications 3. ...