HP BladeSystem c-Class architecture
Page 1
... bandwidth and performance ...11 NonStop signal midplane scalability 11 Power backplane scalability and reliability 13 Power and cooling architecture with HP Thermal Logic 13 Server blades and processors ...14 Enclosure ...14 Configuration and management technologies 16 Integrated Lights-Out...16 Onboard Administrator...17 HP Insight Control and HP Insight Dynamics 17 HP Virtual Connect and Virtual...
... bandwidth and performance ...11 NonStop signal midplane scalability 11 Power backplane scalability and reliability 13 Power and cooling architecture with HP Thermal Logic 13 Server blades and processors ...14 Enclosure ...14 Configuration and management technologies 16 Integrated Lights-Out...16 Onboard Administrator...17 HP Insight Control and HP Insight Dynamics 17 HP Virtual Connect and Virtual...
HP BladeSystem c-Class architecture
Page 2
...interconnect modules (switches, pass-thru modules, and Virtual Connect modules), a NonStop passive signal midplane, a passive power backplane, power supplies, fans, and Onboard Administrator modules. Here at http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-servers.html#bl. This technology brief ...Flex-10 technologies. This integrated aspect of the components within BladeSystem c-Class and explains how they work together, but it was introduced in 2006. For product details, refer to the HP BladeSystem website at www.hp.com/go/bladesystem or refer to other ...
...interconnect modules (switches, pass-thru modules, and Virtual Connect modules), a NonStop passive signal midplane, a passive power backplane, power supplies, fans, and Onboard Administrator modules. Here at http://h18004.www1.hp.com/products/servers/technology/whitepapers/proliant-servers.html#bl. This technology brief ...Flex-10 technologies. This integrated aspect of the components within BladeSystem c-Class and explains how they work together, but it was introduced in 2006. For product details, refer to the HP BladeSystem website at www.hp.com/go/bladesystem or refer to other ...
HP BladeSystem c-Class architecture
Page 5
...provide better airflow across the DIMMs. 5 The BladeSystem enclosures use requirements. The BladeSystem c-Class interoperates and connects with management tools to hold the half-height blades in the c3000 enclosure) to the NonStop signal midplane. For example, you can scale... Ethernet, Fibre Channel, FCoE, InfiniBand, iSCSI, and Serial Attached SCSI (SAS). BladeSystem interconnect modules support a variety of compute, storage, and networking capabilities, integrated with other HP infrastructure pieces, including external storage components such as DAS (direct-attached storage), NAS ...
...provide better airflow across the DIMMs. 5 The BladeSystem enclosures use requirements. The BladeSystem c-Class interoperates and connects with management tools to hold the half-height blades in the c3000 enclosure) to the NonStop signal midplane. For example, you can scale... Ethernet, Fibre Channel, FCoE, InfiniBand, iSCSI, and Serial Attached SCSI (SAS). BladeSystem interconnect modules support a variety of compute, storage, and networking capabilities, integrated with other HP infrastructure pieces, including external storage components such as DAS (direct-attached storage), NAS ...
HP BladeSystem c-Class architecture
Page 11
...differential signal impedance along each lane consists of four SerDes transmit/receive traces). One of up to -end signal trace across the NonStop signal midplane. It does not include additional traffic capacity between device bays and interconnect bays is up to 160 Gb/s per lane ... can hold two off-the-shelf PCI-X or PCIe cards High bandwidth and performance HP engineers architected the BladeSystem c-Class enclosures to support future technologies and the anticipated demand for signal integrity to minimize end-to-end signal losses across the signal midplane Moving the...
...differential signal impedance along each lane consists of four SerDes transmit/receive traces). One of up to -end signal trace across the NonStop signal midplane. It does not include additional traffic capacity between device bays and interconnect bays is up to 160 Gb/s per lane ... can hold two off-the-shelf PCI-X or PCIe cards High bandwidth and performance HP engineers architected the BladeSystem c-Class enclosures to support future technologies and the anticipated demand for signal integrity to minimize end-to-end signal losses across the signal midplane Moving the...
HP BladeSystem c-Class architecture
Page 12
...integrity considerations for that it has no active components along the high-speed signal paths. Figure 11. Reflection losses are caused by iLO on each server blade) identifies the channel topology for each device and configures the proper equalization settings for HP BladeSystem" available at http://h20000.www2.hp...Receive Signal Pins Interconnect Bay Connector Transmit Signal Pins Ground plane For more information about what we designed the NonStop signal midplane as conductor and dielectric material losses, increase at connectors. Insertion losses, such as a completely ...
...integrity considerations for that it has no active components along the high-speed signal paths. Figure 11. Reflection losses are caused by iLO on each server blade) identifies the channel topology for each device and configures the proper equalization settings for HP BladeSystem" available at http://h20000.www2.hp...Receive Signal Pins Interconnect Bay Connector Transmit Signal Pins Ground plane For more information about what we designed the NonStop signal midplane as conductor and dielectric material losses, increase at connectors. Insertion losses, such as a completely ...
HP BladeSystem c-Class architecture
Page 13
...EEPROM which the Onboard Administrator uses to get information such as the HP NonStop S-series, core networking switches from HP Networking, Cisco, and Juniper Networks, and core SAN switches from the NonStop signal midplane. These design choices result in high-availability solutions such ...midplane is constructed of traces and connectors. primarily of solid copper plates and integrated power delivery pins to provide power distribution with HP Thermal Logic With the BladeSystem architecture, HP consolidated power and cooling resources while efficiently sharing and managing them within an ...
...EEPROM which the Onboard Administrator uses to get information such as the HP NonStop S-series, core networking switches from HP Networking, Cisco, and Juniper Networks, and core SAN switches from the NonStop signal midplane. These design choices result in high-availability solutions such ...midplane is constructed of traces and connectors. primarily of solid copper plates and integrated power delivery pins to provide power distribution with HP Thermal Logic With the BladeSystem architecture, HP consolidated power and cooling resources while efficiently sharing and managing them within an ...