Service Manual
Page 72
..., the less spare space where can get IC with getting damp 2) CHIP resistor + CHIP CAPACITOR 3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE 4) EPOXY MOLDING * 42 V6 COF is controlled by COF when be on PCB directly, a soldering defect rate decrease. * composition 1) FPC + Heat /Sink ⇒ FPC for COF must have...
..., the less spare space where can get IC with getting damp 2) CHIP resistor + CHIP CAPACITOR 3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE 4) EPOXY MOLDING * 42 V6 COF is controlled by COF when be on PCB directly, a soldering defect rate decrease. * composition 1) FPC + Heat /Sink ⇒ FPC for COF must have...